English
Interview: JEDEC on LPDDR3
Kristin Lewotsky, EETimes
5/25/2012 2:53 PM EDT
In response to surging bandwidth demand from the mobile device market, the JEDEC Solid State Technology Association just released LPDDR3, a new mobile memory standard that boasts a data rate of 1600 Mbps. We sat down with Hung Vuong, Chairman of JEDEC’s JC-42.6 Subcommittee for Low Power Memories to talk about the new standard, memory challenges, and what comes next.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- JEDEC Announces Publication of LPDDR3 Standard for Low Power Memory Devices
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- Brite Semiconductor Releases DDR3/4, LPDDR3/4 Combo IP
- Interview with Xiphera CEO - Adapting to Market Changes
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation