Analog Devices and TSMC Collaborate on New Analog Process Technology Platform
Norwood, MA and Hsinchu, Taiwan – June 20, 2012 – Analog Devices, Inc. (NASDAQ: ADI) and TSMC (TWSE: 2330, NYSE: TSM) today announced a collaboratively developed analog process technology platform for precision analog integrated circuits (ICs).
The new process technology platform significantly improves analog performance for a number of devices, including A/D and D/A converters, power management devices, and audio coders/decoders that are widely used in consumer, communication, computer, industrial, and automotive applications. Performance enhancements achieved with the 0.18 micron, 5-volt process include an order of magnitude noise improvement, a 70 percent lower standby leakage current, a 50 percent improvement in linearity and a 50 percent better capacitor and resistor matching.
Recently introduced ADI products developed with the new platform include isolated CAN (control-area network) transceivers; a HART (Highway Addressable Remote Transducer) modem IC; an ECG (electrocardiogram) AFE (analog front-end); a series of digital potentiometers, and an audio codec.
TSMC’s 0.18-micron, BCD process supports a range of operating voltages and provides cost-effective operation with a minimal footprint and a high degree of energy efficiency. It lends itself to many computer, industrial and consumer applications.
“The close, long-term technology relationship between Analog Devices and TSMC has enabled the development of this new industry-leading analog technology platform,” said David Robertson, vice president, Analog Technology, Analog Devices. “The combination of an optimized process along with circuit and architecture innovation is key for our high-performance converter and linear products. This TSMC process provides a valuable addition to ADI’s process technology portfolio.”
“ADI has worked with TSMC since the 0.6-micron and 0.35-micron analog processes,” said Rick Cassidy, president, TSMC North America. “Our collaboration on this important, new platform demonstrates the ADI/TSMC commitment to specialty technology development, and the great number of applications these improved products will enable.”
About Analog Devices
Innovation, performance, and excellence are the cultural pillars on which Analog Devices has built one of the longest standing, highest growth companies within the technology sector. Acknowledged industry-wide as the world leader in data conversion and signal conditioning technology, Analog Devices serves over 60,000 customers, representing virtually all types of electronic equipment. A leading global manufacturer of high-performance integrated circuits used in analog and digital signal processing applications, Analog Devices is headquartered in Norwood, Massachusetts, with design and manufacturing facilities throughout the world. Analog Devices is included in the S&P 500 Index. http://www.analog.com
About TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry segment’s largest portfolio of process-proven libraries, IPs, design tools and reference flows. The Company’s managed capacity in 2011 totaled 13.22 million (8-inch equivalent) wafers, including capacity from three advanced 12-inch GIGAFAB™ facilities, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC China, and its joint venture fab, SSMC. TSMC is the first foundry to provide 28nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com
|
Related News
- Siemens announces EDA milestones and tool certifications for TSMC's latest process technologies
- Synopsys and TSMC Collaborate to Develop Interface, Analog and Foundation IP for 12-nm FinFET Process
- Synopsys and TSMC Collaborate to Develop Integrated IoT Platform for TSMC 40-nm Ultra-Low-Power Process
- Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process, Companies Collaborate on 10nm FinFET
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |