Dolphin Integration's breakthrough offering to spread Audio Codecs over AP and PMIC

Grenoble, France – July 2nd,  2012-- Splitting efficiently an Audio Codec, into its Analog Front-end (AFE) and its logic filters, requires a wise interface and Dolphin's proprietary Bow interface makes the difference.

Depending on their architectural involvement, codec users may prefer the fully embedded XENON at 40 nm, including its regulator for noise resilience in the midst of an Application processor, or else they may prefer the fully embedded HELIUM 3, based on an experienced know-how in mature technological nodes like180/160/152 nm within a companion chip, PMIC or mixed signal peripheral circuit.

In other words the logic filters can now be embedded anywhere from 180 to 28 nm.

Dolphin Integration Audio Codecs push flexibilities of integration

The revolution of HELIUM 3 comes from the innovative possibility to split the analog and the logic filters, even inside the same IC. The Bow interface empowers SoC integrators and Fabless suppliers to thus have the choice to embed logic like an AP at an advanced node such as 65/55/40/28 nm or to keep it at the PMIC node.

HELIUM 3 has been especially designed to fit the next generations of Portable Media Players, Smartphones, Tablets or Wireless applications. Thanks to more than 25 years of Audio codec expertise, Dolphin Integration is offering the largest range of configurations to suit each project:

• PLL less master clock system
• Internal regulator
• Pop Up Noise reduction system
• Capless virtual ground for headphone outputs
• Asynchronous Data Audio System in slave or master mode
• Specific pads design
• DACs of class AB or class D
• Appropriate Case-study models and Transfer packages

In addition to this new offer, Dolphin Integration continues to take a particular attention to support their Silicon IP users during the integration process through his Field Application Engineers dedicated to Audio IPs and through a transfer of know-how with Case study Tutorial Products (CTP) to master integration and application issues such as jitter, power Supply noise, pop-up noise in simulation prior to any silicon fabrication.

HELIUM 3 key benefits:

• Ultra Low power (up to 4 mW)
• High End Performance (SNR 95 dB)
• Easiest configurations thanks to the Flex Audio design
• HELIUM 3 was made for low BoM configurations as well as high density thanks to a large range of features or functionalities
• Resilient to Pop-Up-Noise, Jitter, Power supply Noise…

Availability:

HELIUM 3 is available now.

Presentation sheetsare available for free download:

• sCODS95-N.01-Helium3-Bow
• mCODS95-N.02-Helium3-Bow

Need more information? Please, feel free to contact at jazz.audio@dolphin.fr

ABOUT DOLPHIN INTEGRATION

Dolphin Integration is up to their charter as the most adaptive and lasting creator in the Microelectronics Design Industry to "enable mixed signal Systems-on-Chip". It stars a quality management stimulating reactivity for innovation as well as independence and partnerships with Foundries. Their current mission is to supply worldwide customers with fault-free, high-yield and reliable sets of CMOS Virtual Components, such as mixed signal high-resolution converters for audio and measurement applications, Libraries of memories and standard cells, Power management networks, Microcontrollers. The strategy is to follow product launches with evolutions addressing future needs, emphasizing resilience to noise and drastic reductions of power-consumption at SoC level, thanks to their own missing EDA solutions enabling Support Engineering with Application Hardware Modeling as well as early Power and Noise assessment, plus engineering assistance for Risk Control

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