English
Ecosystem emerges around new mobile chip tech
George Leopold, EETimes
7/11/2012 12:15 PM EDT
SAN FRANCISCO – A consortium touting fully depleted silicon-on-insulator (FDSOI) technology for mobile computing applications presented a united front this week in promoting the process technology as a viable alternative to Intel’s FinFET manufacturing approach.
ARM, IBM, Soitec and STMicroelectronics along with foundry partner Globalfoundries and R&D organizations like CEA-Leti made their case for the FDSOI approach at the Semicon West conference here. They also stressed the need for “collaborative innovation” as new mobile technologies grow in complexity and cost. “The need to collaborate has never been more important,” said Gary Patton, vice president of IBM’s Semiconductor R&D Center.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- IC Knowledge's Cost Modeling of Semiconductor Manufacturing Shows Fully Depleted Silicon-on-Insulator Technology to be the Most Cost-effective Approach at the 22nm Node
- Soitec announces adoption of fully depleted technology for advanced mobile platforms
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices
- Cadence Strengthens Tensilica Vision and AI Software Partner Ecosystem for Advanced Automotive, Mobile, Consumer and IoT Applications
- Mobile Semiconductor Introduces a 22nm FDX (FDSOI) ULP Memory Compiler with Market Leading Features
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation