USB V3.1 Power Delivery Type-C Port Evaluation board for OTI9108 IP
ARM, TSMC lead Intel in SoC, says CEO East
Peter Clarke, EETimes
7/26/2012 7:44 AM EDT
LONDON – ARM CEO Warren East is not concerned that Intel Corp. is developing a lead in process technology of the foundries that ARM licensees usually deal with. This is despite the fact that FinFET technology for ARM processors may not be in volume production until the second-half of 2015, according to foundry Taiwan Semiconductor Manufacturing Co. Ltd.
The use of FinFETs, where transistors stick up above the surface, is considered to improve the performance of transistors and reduce leakage current in the off-state. Intel is already manufacturing in volume using in a 22-nm FinFET CMOS process while TSMC is attempting to ramp up planar 28-nm CMOS for is customers.
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