Xelic Announces China Sales Representative
August 6, 2012 – Xelic, a leading provider of Optical Transport Networking (OTN) intellectual property is pleased to announce that Pinnacle Design Systems, Ltd. is now representing them in the Greater China region.
With offices in Shanghai, Pinnacle Design Systems is a focused channel partner bringing leading edge IP and IP-related technologies to the Greater China region. Pinnacle specializes in introducing best-in-class interface, fabric and analog IP to the high-growth Greater China SoC market place.
“We are very excited to have Pinnacle representing Xelic in China” said Mark Gibson, founding partner at Xelic. “The communications market in China is growing rapidly. We believe our broad product offering will be very well received”.
Xelic offers standards based intellectual property products which include OTN framers, mappers, multiplexers, ethernet processors, Forward Error Correction (FEC) and Enhanced FEC (EFEC) solutions. Xelic IP can be targeted for both ASIC and FPGA applications and supports line rates up to 120Gb/s.
Current and potential customers can contact Pinnacle Design Systems at:
Pinnacle Design Systems, Ltd
Rm 2043, 20/F Catic Building,
212 Jiangning Rd, Jing'an District
Shanghai, China 200041
Tel: +86-2122306756
Email: sales@pinnacle-ipcores.com
To learn more about Xelic’s IP products visit www.xelic.com, Email information@xelic.com or call 585-383-5640.
|
Related News
- SmartDV Appoints HyperSilicon Exclusive Sales Representative in China
- MoSys Signs Sales Representative Agreement with Crescendo Technologies Ltd.; Partnership Strengthens Market Presence in China
- Sonics Appoints Maojet as New Sales Representative in Taiwan to Support Taiwan and China Sales
- Micon Global Selected as Sales Representative for Blue Cheetah Analog Design
- Avant Technology Appointed as Sales Representative in Asia for EnSilica's eSi-Crypto IP
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |