Mentor Graphics Files Patent Infringement Suit against EVE
WILSONVILLE, Ore., August 17, 2012—Mentor Graphics Corporation (NASDAQ: MENT) today announced it had filed another patent infringement suit against EVE in the U.S. Federal District Court for the District of Oregon.
The suit alleges that EVE products violate Mentor Graphics’ patent rights under United States Patent No. 6,947,882, entitled “Regionally Time Multiplexed System” issued September 20, 2005, and seeks to recover damages and to bar the manufacture and sale of the infringing products.
“As we continue to learn more about EVE’s products, and discover infringement of our intellectual property,” said Tom Evans, corporate intellectual property counsel for Mentor Graphics, “we will continue to aggressively protect that intellectual property.”
About Mentor Graphics
Mentor Graphics Corporation is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues in the last fiscal year of about $1,015 million. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site: http://www.mentor.com.
|
Related News
- Mentor Graphics Files Patent Infringement Suit Against EVE in Tokyo District Court
- Mentor Graphics Files Patent Infringement Suit against EVE
- EVE Will Continue to Defend Itself Against Mentor Graphics' Patent Infringement Suits
- Appeals Court Affirms Finding of Patent Invalidity in Suit Against Mentor in California
- Mentor Graphics Wins Patent Infringement Case, Awarded Damages
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |