Sonics Announces New Webinar, Making Mobile SoC Device Design Easier With System IP
MILPITAS, CA-- Aug 17, 2012- Sonics, Inc.®, the leading supplier of system IP for cloud-scale SoCs, today announced an online seminar showing how mobile SoC device design can be made easier with system IP.
Date: Tuesday, August 21, 2012
Time: 11:00 a.m. (Pacific Daylight Time)
Subject: Making Mobile SoC Device Design Easier with System IP
Register: http://seminar2.techonline.com/s/sonics_aug2112
Webinar attendees will learn the following:
- How to integrate and optimize multiple IP blocks for complex SoC designs to meet their customer's requirements for system performance, power and cost.
- How to efficiently support system testing and verification
- How to seamlessly integrate IP cores from multiple vendors
- How System IP can help accelerate their next design cycle
The high design complexity of today's SoCs (such as those driving the cloud computing revolution) is making it difficult for SoC architects to execute flawless designs on time and on budget.
This webinar will focus on how Sonics can help designers deal with this challenge through the use of advanced System IP. Specifically, Sonics will discuss how to use System IP to increase performance, significantly improve power management, decrease costs and accelerate time-to-market for complex SoCs.
About Sonics
Sonics, Inc. is the leader of system IP for cloud-scale SoCs. As a pioneer of network-on-chip (NoC) technology, Sonics offers SoC designers one of the world's largest portfolios of system IP for mobile, digital entertainment, wireless and home networking. With a broad array of silicon-proven IP, Sonics helps designers eliminate memory bottlenecks associated with complex, high-speed SoC design, streamline and unify data flows and solve persistent network challenges in embedded systems with multiple cores. Sonics has more than 110 patent properties to date and has enabled its customers to ship more than one billion chips worldwide. Founded in 1996, Sonics is headquartered in Milpitas, Calif. with offices worldwide. For more information, please visit www.sonicsinc.com and www.sonicsinc.com/blog.
|
Related News
- Synopsys and Arm Strengthen Collaboration for Faster Bring-Up of Next-Generation Mobile SoC Designs on the Most Advanced Nodes
- Cadence Delivers 13 New VIP and Expands System VIP Portfolio to Accelerate Automotive, Hyperscale Data Center and Mobile SoC Verification
- Cadence Accelerates Industrial, Automotive, Hyperscale Data Center, and Mobile SoC Verification with Expanded VIP and System VIP Portfolio
- Webinar : USB 3.1 Gen2 Device Controller IP Core usage in Intel Quartus Prime Pro
- Spectral Design & Test Inc. Announces 3rd Generation 45RFSOI Low Power SRAM Targeted at the 5G Mobile Device SoC Market
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |