TSMC said to plan 450-mm production for 2018
Peter Clarke, EETimes
9/5/2012 8:37 AM EDT
LONDON – Foundry chip maker Taiwan Semiconductor Manufacturing Co. Ltd. now foresees the start of volume production of ICs on 450-mm diameter wafers in 2018, according to local reports that reference J.K.Wang, TSMC's vice president for operations speaking ahead of the Semicon Taiwan exhibition and conference. The reports said that TSMC believes pilot lines could be running in 2016 or 2017.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
Breaking News
- TDK announces availability of automated ML Platform Integration for Arm® Keil® MDK
- Remote.It Simplifies Secure Access to Arm Virtual Devices
- 12bit 2Msps Silicon proven SAR ADC IP Core with Ultra-low power is available in different technology nodes for various applications that includes IoT, Medical, Consumer, etc
- CoreHW secures €4M investment to accelerate growth in indoor positioning solutions
- M31 hit a record high of revenue and profit in last year, and it expects to sustain a double digit growth throughout the year
Most Popular
- At Embedded World 2023, Dolphin Design showcases AI-based vision applications at sub-mW level that fit in less than 1MB RAM
- Introducing Signature IP Corporation - Providing a Configurable And Flexible Platform for SoC Development
- CoreHW secures €4M investment to accelerate growth in indoor positioning solutions
- M31 hit a record high of revenue and profit in last year, and it expects to sustain a double digit growth throughout the year
- Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023