TSMC said to plan 450-mm production for 2018
Peter Clarke, EETimes
9/5/2012 8:37 AM EDT
LONDON – Foundry chip maker Taiwan Semiconductor Manufacturing Co. Ltd. now foresees the start of volume production of ICs on 450-mm diameter wafers in 2018, according to local reports that reference J.K.Wang, TSMC's vice president for operations speaking ahead of the Semicon Taiwan exhibition and conference. The reports said that TSMC believes pilot lines could be running in 2016 or 2017.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation