Fujitsu Semiconductor Adopts Mentor Graphics HyperLynx for Fast and Accurate SerDes Signal Integrity Analysis
WILSONVILLE, Ore., September 6, 2012 — Mentor Graphics Corporation (NASDAQ: MENT) today announced that Fujitsu Semiconductor Limited has adopted the Mentor Graphics® HyperLynx® Signal Integrity (SI) analysis product for deploying their new 5.0 Gbps USB 3.0 technology, which is a well-known example of SerDes (serializers/deserializers) designs. Fujitsu Semiconductor integrated their IBIS-AMI (I/O Buffer Information Specification - Algorithmic Modeling Interface) with the HyperLynx Channel Analysis technology and achieved high-speed analysis while maintaining the accuracy equivalent to transistor models. Fujitsu Semiconductor has adopted HyperLynx technology as a standard tool for LSI-IC Packaging-Printed Circuit Board co-design tool for memory interfaces such as DDR2/3/4 since last year, and this announcement is the result of the first introduction.
As USB 3.0 becomes popular, more devices are developed based on the SI analysis in 5Gbps bandwidth. In this bandwidth, transistor models are mainly used in simulation to ensure accuracy, but can cause problems with its longer simulation time. Typical IBIS models can be used for shortening simulation time; however, correct results may not be obtained due to the accuracy of IBIS models or different interpretations of simulators. Fujitsu Semiconductor succeeded in maintaining the accuracy needed for USB 3.0 and other multi-Gbps technologies while shortening the simulation times by integrating their IBIS-AMI modeling technology and the HyperLynx tool.
“Fujitsu Semiconductor is working together with our customers and partners to resolve both the signal and power integrity challenges that are becoming more and more complicated in conjunction with size reduction. We have adopted HyperLynx technology as a common tool for Fujitsu Semiconductor. It provides our customers with high accuracy as well as reduction of analysis time. This led us to build the precision-verified USB 3.0 Compliance Simulation Kit. We believe that Fujitsu Semiconductor and our customers can expect improved design productivity as well as development cost reduction with the Mentor Graphics best-in-class global customer support,” said Naoshi Higaki, Assistant Vice President of Design Methodology & Product Engineering Division, Fujitsu Semiconductor.
HyperLynx SI has a built-in 3D electromagnetic field analysis tool for accurately modeling via holes to prevent issues in high-speed signals, especially for SerDes. With HyperLynx SI, accuracy and ease-of-use are combined with advanced functionalities: high-speed simulation of IBIS-AMI model correspondences, parameter sweeping, eye-diagram patterns and analysis set-up using wizards.
“We are pleased that Fujitsu Semiconductor has positioned our HyperLynx technology as a strong signal integrity tool, and are proud to see how efficient it is for multi-Gbps channel analysis,” said David Kohlmeier, High-speed Analysis Product Line Director, Mentor Graphics Systems Design Division. “Mentor is continuously investing in advanced design and analysis solutions to help our key customers, such as Fujitsu Semiconductor, achieve higher productivity and reduced costs.”
To learn more about the Mentor® HyperLynx advanced signal integrity analysis product, visit the company website at: www.mentor.com/hyperlynx.
|
Related News
- Triad Semiconductor and Mentor Graphics Announce Low Cost Mixed-Signal Design with ViaDesigner
- Freescale Semiconductor Collaborates with Mentor Graphics on Tessent Silicon Test, Yield Analysis, Calibre Physical Verification and DFM
- Mentor joins Nano 2022 R&D program to foster innovation in semiconductor design and verification
- Mythic adopts Mentor's Analog FastSPICE and Symphony platforms for AI processor design
- Mentor sets new software scaling benchmark for Semiconductor Design Workload on Microsoft Azure
Breaking News
- Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
- Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
- Arasan announces its Total eMMC IP solution for TSMC 22nm process
- MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
- Faraday Unveils Complete Imaging and Display High-Speed Interface IP Set on UMC 28nm and 40nm Processes
Most Popular
- Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
- Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
- Gartner Says Worldwide Semiconductor Revenue Grew 7.3% in 2020
- SEGGER introduces new Open Flashloader for direct programming of any RISC-V system
- Arasan Announces the Immediate Availability of its 2nd Generation MIPI D-PHY v1.1 IP for TSMC 22nm Process Technology
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |