Camera SLVS-EC v.2.0 5.0Gbps / MIPI D-PHY v2-1 4.5Gbps combo Receiver 4-Lane
IPhone 5 bill of materials estimate is $167.50
EETimes
9/12/2012 8:20 PM EDT
OTTAWA – The bill of materials for Apple’s new IPhone 5 comes in at an estimated $167.50 for the 16-Gb version, or about $35 higher than a comparable version of the IPhone 4S, according to a preliminary estimate by the tear down specialists at TechInsights.
The preliminary analysis by TechInsights, which is owned by UBM, the publisher of EE Times, is based on initial information about the IPhone 5 that was released by Apple in San Francisco on Wednesday (Sept. 12). The IPhone 5, which is scheduled to go on sale Sept. 21, is expected to sell for about $199 for the 16-Gb version.
TechInsight analysts also based their estimates on previous versions of 16-Gb IPhones, including the known features and cost of components for the IPhone 4 and 4S.
E-mail This Article | Printer-Friendly Page |
Related News
- iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
- iPhone 7 Materials Costs Higher than Previous Versions, IHS Markit Teardown Reveals
- iPhone 5 Carries $199 BOM, Virtual Teardown Reveals
- Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
- Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process