Altera readies cores, tools for upcoming Stratix
![]() |
Altera readies cores, tools for upcoming Stratix
By Anthony Cataldo, EE Times
April 29, 2002 (2:16 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020429S0046
SAN MATEO, Calif. Though months away from delivering its next-generation FPGA architecture, Altera Corp. has been preparing cores and software tools so that customers can start their designs as soon as the architecture hits the streets.
The company on Monday (April 29) announced version 2.1 of its Nios soft-core embedded processor. The processor is targeted for use in Altera's Stratix devices, slated to debut in the next couple of months.
Largely because of the new routing structure used in Stratix, the 32-bit Nios' clock speed will rise from 80 to 125 MHz. Stratix's multitrack uses three route lengths, with varying drive strengths, buffers and spacing, and is designed for connecting IP cores in the FPGA fabric.
More RAM will be made available for each of the logic elements in Stratix than is made available in Altera's existing Apex FPGAs. The megaRAM blocks run at up to 300 MHz, and the largest Stratix device will cont ain 10 Mbits of memory.
Nios 2.1 will ship to all customers with valid subscriptions and will cost $495 for new subscriptions. Altera expects to start selling the first Stratix device, called the 1S25, in June.
Related News
- Altera Demonstrates Dual-mode 56-Gbps PAM-4 and 30-Gbps NRZ Transceiver Technology for Stratix 10 FPGAs and SoCs
- Intilop delivers on Altera FPGAs, their 7th Gen. industry first, Full TCP, UDP & IGMP Hardware Accelerator System with Dual 10G ports for all Hyper Performance Networking Systems
- Algo-Logic Systems Launches Industry-First 40Gbps TCP Endpoint on Altera Stratix V for Datacenter Acceleration
- Altera Reveals Stratix 10 Innovations Enabling the Industry’s Fastest and Highest Capacity FPGAs and SoCs
- Algo-Logic Systems Launches Datacenter Rack Solutions with Scalable Search and Switch for 10G/40G/100G Networks
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |