SK Hynix Introduces DDR3L-Reduced Standby for Mobile Solutions
Seoul, September 12, 2012 – SK Hynix (‘the Company’, www.skhynix.com) announced that it has introduced DDR3L-RS(Reduced Standby) DRAM for mobile solutions using its 20nm class technology. This product significantly reduces the standby power consumption.
By using cutting-edge 20nm class technology and efficiently managing standby current, this DDR3L-RS product reduces 70% of standby power compared to existing DDR3L DRAM while it maintains DDR3L performance. DDR3L DRAM which has recently gone mainstream works at 1.35V, while DDR3 DRAM does at 1.5V.
This product is available in both chip and module types. Chips for on-board use enable thinner devices to implement various densities with 2Gb(gigabit), 4Gb and 8Gb. SO-DIMMs(Small Outline Dual Inline Memory Module) are also provided with densities of 2GB(gigabyte), 4GB and 8GB.
The DDR3L-RS is expected to evolve into the best memory solution in the Ultrabook™ and tablet PC markets which highly require mobility and low power figure. The product is especially price competitive than LPDDR3 and significantly reduces standby current than existing DDR3L. As it combines performances of mobile DRAM and PC DRAM, SK Hynix expects to penetrate into the new market including low to mid-end ultabooks and tablets with this intermediary product and lead the mobile market.
“With the release of the new DDR3L-RS DRAM, we are now able to provide price competitive and low power products to the customers and these products will open a new area of memory semiconductor as one of the best memory solutions for the low to mid-end market,” said Mr. Ji Bum Kim, Head of Worldwide Marketing & Sales Division of SK Hynix.
According to market research firm iSuppli, the portion of the ultrathin shipments in the laptop market is expected to be 11% in 2012 and will eventually be expanded up to 39% in 2014. In 2015, it will jump to the half of the lap top market with 52% share.
About SK Hynix Inc.
SK Hynix Inc., Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips ("NAND Flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.
|
Related News
- Cadence Demonstrates Interoperability with SK hynix's Highest Speed LPDDR5T Mobile DRAM at 9600Mbps
- HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
- Creonic GmbH Introduces Advanced 5G LDPC Encoder IP core for Enhanced Mobile Broadband Connectivity
- SK hynix's memory chips next in Huawei's 5G phone saga
- SK hynix adopts Siemens' Polarion to help gain Korea's first ASPICE certification
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |