English
Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
ARM's East cites power as key IC design driver
Peter Clarke, EETimes
11/2/2012 12:15 PM EDT
SANTA CLARA, Calif. – The prospect of both climate change and "unsustainable" data growth means engineers should focus on reducing power consumption in their device designs, according to Warren East, CEO of ARM
In an ARM TechCon keynote here Thursday (Nov. 1), East sketched a future of vastly different design considerations that span everything from servers and cloud infrastructure to the billions of devices that will comprise the Internet of Things. East also used the keynote to announce that ARM is becoming a promoter member of the Weightless Special Interest Group that was originally created by Neul Ltd., a startup company that also comes from Cambridge, England.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Arm Ltd Hot IP
Related News
- Toumaz Licenses compact configuration of Barco Silex's Public Key IP (BA414E) in its ultra-low power wireless IC for its healthcare product
- Arm's power play will backfire
- NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
- New iPhone Models Become Key to Qualcomm's Top Spot in 3Q20 Revenue Ranking of Global Top 10 IC Design (Fabless) Companies, Says TrendForce
- Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation