NVM OTP in UMC (180nm, 153nm, 110nm, 90nm, 80nm, 55nm, 40nm, 28nm, 22nm)
Broadcom sees rising 20 nm costs amid handset push
Rick Merritt, EETimes
12/6/2012 3:30 PM EST
SAN JOSE, Calif. – Cost-per-transistor may rise at the 20- and 14-nm generations, Broadcom CEO Scott McGregor said during in the company’s annual analyst day here. Nevertheless, the company will “judiciously” drive more products to newer nodes next year as it rolls out its first LTE chips and gears up for a push into integrated applications processors.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Broadcom Enables Industry's First 20 nm 100G Coherent PHY
- Synopsys exec sees whole new ball game at 20 nm
- Amid Rising Volume and Pricing, Top 10 IC Design Companies Post 2021 Revenue Topping US$100 Billion
- Altera Ships 20 nm SoCs
- Xilinx Expands 20 nm Kintex UltraScale Portfolio for the Most Demanding Data Center Acceleration, Video and Signal Processing Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation