1-112Gbps Medium Reach (MR) and Very Short Reach (VSR) SerDes
CEVA to Showcase Latest DSPs and Platform IPs for Mobile, Digital Home and Automotive at CES 2013
Technologies on display include comprehensive solutions for advanced imaging & vision processing, natural user interface, audio enhancement, voice pre-processing, software-based Wi-Fi 802.11ac, satellite navigation (GNSS) and Bluetooth 4.0 Low Energy
MOUNTAIN VIEW, Calif., Dec. 5, 2012 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it will showcase a range of comprehensive platform IPs targeting the mobile, digital home and automotive markets, including the first silicon-based implementations of Wi-Fi 802.11ac and satellite navigation (GNSS) on the CEVA-XC323 DSP, at CES 2013. At the show, taking place in Las Vegas from January 8-11 th, CEVA will host a private meeting suite in the Las Vegas Hotel (formerly Las Vegas Hilton) where invitees can interact with the demonstrations and meet with CEVA engineering experts and members of the CEVA executive team.
Technologies on display will include:
- Imaging & Vision - CEVA and its partners will demonstrate the latest applications for advanced imaging and vision processing, including advanced touch-free user interface, video stabilization, Dynamic Range Compression (DRC), color enhancement and Advanced Driver Assistance Systems (ADAS) technologies.
- Audio & Voice - CEVA and its partners will demonstrate a comprehensive range of audio and voice applications, including voice pre-processing (echo cancellation, beam forming, noise reduction and more) and audio post-processing (surround virtualization, volume equalization, speaker correction and more).
- Communications & Connectivity - CEVA and its partners will demonstrate software-based Wi-Fi 802.11ac, satellite navigation (GNSS) and Bluetooth 4.0 LE technology.
To request a meeting with CEVA at CES and view the latest advancements in high-performance DSPs and platform IPs, please email events@ceva-dsp.com or contact your local CEVA sales office.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (computer vision, image enhancements and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices and powers handsets from every top handset OEM, including Nokia, Samsung, HTC, LG, Motorola, Sony, Huawei and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
|
Ceva, Inc. Hot IP
Related News
- CEVA Addresses the Next Trends in Mobile, Digital Home and Automotive at CES 2014 with Range of Platform IP Solutions for SoC Design
- CEVA to Showcase Latest IP for Digital Home and Mobile Products at CES 2012
- CEVA to Showcase Industry-Leading Platform IP for Communications, Vision, Imaging, Audio and Voice at Mobile World Congress 2013
- Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications
- Cadence to Showcase Tensilica DSPs and Design IP at Mobile World Congress 2016
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
- Rambus Advances AI 2.0 with GDDR7 Memory Controller IP
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |