Peter Clarke, EETimes
2/7/2013 4:34 AM EST
LONDON – Globalfoundries Inc. has set out a timetable to the high volume production of fully-depleted silicon-on-insulator (FDSOI) chips making the mainstream adoption of the process possible. Globalfoundries (Milpitas, Calif.) had previously signed a memorandum of understanding to manufacture the process with the developer, STMicroelectronics NV (Geneva, Switzerland).
Mike Noonen, executive vice president of worldwide marketing and sales at the foundry chip maker, told an audience at the Common Platform Technology Forum, held at the Santa Clara Convention Center, California, that a physical design kit for the process will be available in the first quarter of 2013.
Click here to read more ...