New mimoOn Library for Tensilica's Baseband DSP IP Cores Speeds Up LTE and LTE-Advanced Chip Designs
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Library Available from Tensilica Saves Customers Millions in Development Costs
SANTA CLARA, Calif. – February 19, 2013 –Tensilica, Inc. and mimoOn today announced a new LTE and LTE-Advanced PHY library that will significantly speed up development of chips including Tensilica’s ConnX BBE32 family of DSP (digital signal processor) IP cores. mimoOn estimates that the library and their reference designs potentially save SOC (system-on-chip) designers as much as $5 million in development costs.
“Tensilica and mimoOn have the only comprehensive LTE and LTE-Advanced hardware/software PHY IP solution,” stated Eric Dewannain, Tensilica’s vice president and general manager, baseband business unit. “By working closely together, we enable our customers to get to market much faster and with the lowest power/area for a programmable LTE and LTE-Advanced solution.”
“Through our partnership, we’ve been able to create a customized library to take advantage of the powerful optimizations in Tensilica’s baseband architecture, which make Tensilica’s ConnX family of DSPs ideal for the compute-intensive challenges of LTE and LTE-Advanced when coupled with our software,” stated Brian Meads, mimoOn’s vice president of marketing. “Our investment in LTE reference designs represents over 75 man-years of effort and is ongoing as the standards evolve.”
The optimized LTE library works with mimoOn’s mi!SmallCellPHY and mi!MobilePHY reference chains, which are complete solutions for 3GPP standards, ensuring 100 percent alignment with the standards and future-proofing investments. The library includes optimized basic functions such as FFT/IFFT and LTE specific functions such as rate matching, modulators, interleaving, channel estimation, UE sync and MIMO equalization. The library is complete in that it supports all of the core functions of the reference designs.
Tensilica and mimoOn will jointly demonstrate a low-power, high-performance LTE User Equipment and eNodeB PHY with real-time downlink and uplink traffic at the upcoming Mobile World Congress 2013, February 25-28, in Tensilica’s booth in Hall 6, stand D101 and in mimoOn’s meeting room in Hall 2, stand 2D60. The efficient software programmable radio demonstration showcases Tensilica’s Atlas hardware LTE Reference Platform, which incorporates all of the required functionality with no need for additional external hardware blocks.
About mimoOn
mimoOn GmbH, headquartered in Duisburg, Germany, is a leading licensor of LTE Software IP for mobile devices & wireless infrastructure. mimoOn's portfolio of products includes Physical Layer (PHY) and Protocol Stack (L2/L3) for mobile terminals, small cells (Pico/Femto) and IP development in the areas of advanced PHY algorithms on multi-core SDR platforms, SON, schedulers and radio resource management. mimoOn provides a complete porting, optimization and verification service, as well as a roadmap to future 3GPP releases. For more information, please visit http://www.mimoon.de.
About Tensilica
Tensilica, Inc. is the leader in dataplane processor IP core licensing with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.
|
Related News
- Tensilica and mimoOn Partner to Provide the Only Comprehensive LTE and LTE-Advanced Hardware-Software PHY IP Solution
- IntegrIT's DSP Math Library Now Available for Tensilica's Baseband DSPs
- HiSilicon, a Division of Huawei, Extends License of Tensilica's IP Cores, ConnX Baseband Engine, and HiFi Audio DSP for LTE Base Stations and Handsets
- MegaChips Selects Tensilica's HiFi Audio/Voice DSP for Consumer Products Designs
- Tensilica's ConnX BBE16 DSP IP Core for Digital Baseband Signal Processing Licensed to Renesas Electronics
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |