Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif. USA – February 21, 2013 – Tensilica, Inc. today announced that it will showcase its complete hardware/software intellectual property (IP) solutions that are leading the market in audio, voice, video, imaging and baseband communications at stand 6D101 at the Mobile World Congress, February 25-28, 2013, in Barcelona, Spain.
“We are very excited to showcase at MWC all of the smartphones and tablets that are using Tensilica for audio/voice, Bluetooth, WiFi and LTE baseband processing,” stated Jack Guedj, Tensilica’s president and CEO. “And with our latest imaging/video DSP, Tensilica is well positioned to expand our lead as the largest DSP IP supplier.”
With its new IVP image/video processor, Tensilica will demonstrate high dynamic range (HDR) capture and video stabilization. Other capabilities, including advanced driver assistance systems (ADAS) features, object and face tracking, feature mapping, and fast warping examples, will also be on display.
Tensilica will have several HiFi audio/voice demonstrations that highlight always-on voice recognition, sound-enhancement technology that delivers dynamic sound from small consumer speakers, and voice echo cancellation, noise reduction and voice quality improvement.
Tensilica will demonstrate the world’s first licensable multi-standard DVB-T2 demodulation IP subsystem that can be programmed to meet all the worldwide DTV demodulation standards and showcases Tensilica’s ConnX BBE16 DSP.
Tensilica and partner mimoOn will feature a FPGA-based demonstration of a transmitter (eNodeB) PHY layer and a handset PHY layer implemented with Tensilica’s ConnX Baseband IP cores. The demonstration shows a download to the handset of two 1080p HD movies and playback on big-screen digital televisions. There is also a simultaneous uplink stream from a camera connected to the handset to a monitor.
Tensilica, Inc. is the leader in dataplane processor IP cores with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.