Tensilica and Huawei Expand Strategic Relationship for Next-Generation Products

Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)

Huawei HiSilicon Licenses Full Range of Tensilica IP Cores

SANTA CLARA, Calif. – February 25, 2013 –Tensilica, Inc. today announced that it has strengthened its strategic relationship with Huawei. HiSilicon, the semiconductor division of Huawei, is expanding its use of Tensilica’s DPUs (dataplane processor units), including Tensilica’s Xtensa customizable processor technology, HiFi DSPs (digital signal processors) for audio and voice processing in smartphones and set-top boxes, and ConnX Baseband Engines for LTE base stations, handsets, and other network infrastructure and customer premise equipment.

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“For more than four years, we have worked very closely with Tensilica on a number of projects,” stated Teresa He, vice president of HiSilicon. “We have found that Tensilica’s DPUs can help us differentiate our products and achieve competitive advantages in terms of power, performance, and area. Tensilica cores have operated as expected and their support has been superb, enabling us to significantly speed up our development time. We are very pleased to strengthen our relationship with this agreement.”

“HiSilicon has seen the value of our standard IP cores and core customization technology, which allows them to get the optimal mix of best-in-class power/performance/area and time-to-market, all backed up by our single tool set,” stated Jack Guedj, Tensilica’s president and CEO. “We are pleased to continue our long-lasting, close working relationship with HiSilicon.”

About Tensilica

Tensilica, Inc. is the leader in dataplane processor IP core licensing with over 200 licensees. Dataplane processors (DPUs) combine the best capabilities of DSPs and CPUs while delivering 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance targets. Tensilica’s DPUs power SOC designs at system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. Tensilica offers standard cores and hardware/software solutions that can be used as is or easily customized by semiconductor companies and OEMs for added differentiation. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.

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