DSP Group's HDClear™ solution leverages high-performance, low-power CEVA-TeakLite-III DSP to deliver a revolutionary noise cancellation technology for mobile devices; Companies to showcase new SoC at Mobile World Congress
MOUNTAIN VIEW, Calif. -- Feb. 25, 2013 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that DSP Group® (NASDAQ: DSPG), a leading global provider of wireless chipset solutions for converged communications, has licensed and deployed the CEVA-TeakLite-III DSP in the latest voice and audio SoC powering its innovative HDClear solution. The high-performance, low-power DBMD2 SoC enables enhanced noise cancellation and maximizes automatic speech recognition (ASR) accuracy in any environment, isolating voice from surrounding environmental noise, enabling mobile users to use their voice effectively anywhere. HDClearis designed to revolutionize the voice user experience in mobile and other consumer electronic devices. The HDClear solution and the DBMD2 SoC will be demonstrated at Mobile World Congress in CEVA's booth (Stand 7i70).
The demand for improved battery life in mobile devices and reduced energy consumption for consumer electronics dictates the need to offload complex and power-hungry audio and voice processing from the main CPU onto a dedicated low-power audio DSP. The DBMD2 SoC efficiently performs complex real-time signal processing functions like noise reduction, beam-forming, voice activation and virtual surround, in addition to addressing voice activation recognition performance and quality issues in noisy environments. The CEVA-TeakLite-III DSP at the core of the DBMD2 SoC easily handles all of these complex tasks, while leaving ample headroom on the DSP for customers and OEMs to further differentiate their product designs by adding proprietary or third party algorithms.
"The CEVA-TeakLite-III DSP provides the perfect balance of ultra-low power and exceptional audio/voice processing for our DBMD2 SoC at the heart of the HDClear solution," said Dr. Arie Heiman, Corporate Vice President and General Manager of HDMobile at DSP Group. "The maturity and robustness of the complete CEVA package, from the DSP implementation through to the CEVA Toolbox™ software development environment and hardware development kit helped us in reaching our demanding goals."
Eran Briman, vice president of marketing at CEVA, commented: "We are pleased to see the quick design turnaround time DSP Group has been able to achieve, with the DBMD2 SoC already available in silicon. The capabilities of their latest HDClear product offering are impressive and firmly position DSP Group on the leading edge of the market for advanced, low power audio/voice platforms. By using the programmable CEVA-TeakLite-III DSP as a foundation, DSP Group enables their customers to differentiate their products via software add-ons and updates, allowing them to evolve and adapt to new market requirements."
About the CEVA TeakLite family
The CEVA-TeakLite-III is a member of the CEVA-TeakLite DSP family, the most successful licensable DSP family in the history of the semiconductor industry, with more than 2.5 billion chips shipped, over 100 licensees, 30 active ecosystem partners and more than 100 audio and voice codecs and enrichment applications available. It is widely deployed in home entertainment SoCs, mobile application processors and audio CODEC chips, handling advanced audio and voice scenarios. To learn more about the CEVA-TeakLite DSP family, visit http://www.ceva-dsp.com/CEVA-TeakLite-Family.html
About DSP Group
DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio of wireless chipsets integrating DECT/CAT-iq, DECT ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers to shape the future of converged communications at home, office and on the go. For more information, visit www.dspg.com.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.