CEVA-Bluetooth platforms provide Beken with cost-efficient, highly-integrated solutions for Bluetooth-enabled ICs
MOUNTAIN VIEW, Calif. -- March 19, 2013 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Beken Corporation, a leading IC supplier for wireless applications in China, has licensed CEVA's Bluetooth 2.1+EDR and Bluetooth 4.0 Low Energy IP solutions for the development of Bluetooth-enabled ICs.
"CEVA provided outstanding engineering support when developing and certifying our 2.1+EDR Bluetooth-enabled product based on their IP," said Dawei Guo, VP of Engineering of Beken Corporation. "We are delighted to extend our relationship with CEVA to include their Bluetooth 4.0 Low Energy Platform as we address the burgeoning smartphone and tablet peripherals markets with our latest ICs."
"Beken is widely recognized in China as a leading fabless semiconductor company for cost-effective wireless communications chips," said Aviv Malinovitch, vice president of operations at CEVA. "Coupling their leading edge RF-CMOS transceiver technology with CEVA-Bluetooth IP provides a strong foundation for the development of industry-leading products and we look forward to continuing our successful collaboration for their next-generation Bluetooth-enabled products."
CEVA-Bluetooth 4.0 IP consists of RTL baseband hardware coupled with an ANSI C software stack. Designed for flexibility, portability and configurability, it is ideal for integration into a wide range of embedded applications. The IP has fully-gated clock operation for low power, and employs standard interfaces such as AMBA (for the processor hardware interface) and BlueRF (for the radio hardware interface).
CEVA-Bluetooth 4.0 is available as a Single Mode (SM) IP package in which a die-efficient Bluetooth Low Energy solution is provided and also as a Dual Mode (DM) IP package whereby the Bluetooth Low Energy protocol is combined with Classic Bluetooth. The Single Mode IP is aimed at Bluetooth Smart products such as keyboards, body-wear sensor products for medical and sports, toys and environment sensors. The Dual Mode IP is primarily aimed at next-generation, multi-radio connectivity chips for Bluetooth Smart Ready products, e.g. smartphones, tablets and other mobile computing platforms. See http://www.ceva-dsp.com/Wireless-Handsets.html for further details on CEVA-Bluetooth and also CEVA's solutions for Wi-Fi 802.11ac and GNSS.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in more than 1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
About Beken Corporation
Beken Corporation is a leading IC supplier for wireless applications in China, developing highly integrated high-performance semiconductor products wielding leading edge RF-CMOS transceiver technology. Founded in February 2005, Beken headquarters are located at Zhangjiang High Tech Park of Pudong New District in Shanghai, China, with sales and customer support offices in Shenzhen and Hong Kong. For further information, visit www.bekencorp.com.