Subramaniam Hariharan joins eSilicon executive team to head global manufacturing operations
SUNNYVALE, Calif. — March 21, 2013 — eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced the addition of Subramaniam (Hari) Hariharan to its executive team as vice president, global manufacturing operations.
"Hari will lead our global manufacturing and operations (GMO) team to further drive excellence in quality, speed and cost effectiveness to our global customer base," said Jack Harding, eSilicon's president and CEO. "Hari's extensive expertise in manufacturing, operations and supply chain, driving change and successfully deriving business value, make him ideally suited to lead the next evolution of GMO for eSilicon."
Hariharan has over 30 years of experience in operations management and strategic planning at various organizations in Singapore, Canada and the U.S. In his most recent role, he was vice president, global manufacturing operations and quality at Gennum Corporation. Prior to Gennum, he held various senior manufacturing management roles at ST Microelectronics and R&D roles at Indian Telephone Industries, Ltd. Hariharan has a Bachelor of Engineering in Electronics and Communications from University of Kerala, India and a Master of Business from Royal Melbourne Institute of Technology, Australia.
About eSilicon
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.
|
Related News
Breaking News
- eInfochips Wins Design Services Company of the Year Award from IESA
- Samsung Foundry Certifies Analog FastSPICE Platform from Siemens for Early Design Starts on 3nm GAA Process Technology
- Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
- Arasan announces its Total eMMC IP solution for TSMC 22nm process
- MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
Most Popular
- Cadence to Acquire NUMECA to Expand System Analysis Capabilities with Computational Fluid Dynamics
- Arasan announces its Total eMMC IP solution for TSMC 22nm process
- Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
- Industry R&D Spending To Rise 4% After Hitting Record in 2020
- Silvaco Acquires Physical Verification Solution Provider POLYTEDA CLOUD LLC
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |