English
3-D integration takes spotlight at ISPD
R Colin Johnson, EETimes
3/26/2013 11:57 AM EDT
LAKE TAHOE, Nev.—Three-dimensional integration was the focus on the kickoff day for the annual International Symposium on Physical Systems (ISPD), where semiconductor designers worldwide show-off their next-generation aspirations for the physical design of future chips.
Keynoting the 3-D track was veteran chip architect Liam Madden, vice president of FPGA development at Xilinx Inc. (San Jose, Calif.) who claimed that chip designers can have their 3-D cake and eat it, too.
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