3-D integration takes spotlight at ISPD

R Colin Johnson, EETimes
3/26/2013 11:57 AM EDT

LAKE TAHOE, Nev.—Three-dimensional integration was the focus on the kickoff day for the annual International Symposium on Physical Systems (ISPD), where semiconductor designers worldwide show-off their next-generation aspirations for the physical design of future chips.

Keynoting the 3-D track was veteran chip architect Liam Madden, vice president of FPGA development at Xilinx Inc. (San Jose, Calif.) who claimed that chip designers can have their 3-D cake and eat it, too.

Click here to read more ...