English
Would the real Apple A5 please stand up?
Paul Boldt, Don Scansen
EETimes (4/1/2013 12:20 PM EDT)
March 10 kicked off an exciting few days for the Apple semiconductor watcher. First came the rumors of a major shrink of the A5, followed by evidence of no shrink and then pictures of a redesigned die 50-percent smaller than the previous generation. All of this was happening within the humble Apple TV, or should I say Apple's semiconductor test bed.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
Breaking News
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- DVB-S2X Wideband LDPC/ BCH Decoder IP Core Available For Integration From Global IP Core
- Cadence Announces Most Comprehensive True Hybrid Cloud Solution to Provide Seamless Data Access and Management
- Dolphin Design expands GoAsic partnership to enhance the semiconductor Industry's Supply Chain
- Cadence Collaborates with MemVerge to Increase Resiliency and Cost-Optimization of Long-Running High-Memory EDA Jobs on AWS Spot Instances
Most Popular
- U.S. Subsidy for TSMC Has AI Chips, Tech Leadership in Sight
- Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
- Zhuhai Chuangfeixin: OTP IP Based on 90nm CMOS Image Sensor Process Technology Successfully Mass Production
- Silvaco Announces Expanded Partnership with Micron Technology
- OPENEDGES Unveils ENLIGHT Pro: A High-Performance NPU IP Quadrupling its Previous Generation's Performance