TSMC starts FinFETs in 2013, tries EUV at 10 nm
Rick Merritt, EETimes
4/11/2013 8:18 AM EDT
SAN JOSE, Calif. – Facing heated competition from Globalfoundries and Samsung, TSMC pulled in plans for initial production of its 16-nm FinFET process to the end of 2013. In addition, it hopes to adopt extreme ultraviolet lithography to make 10-nm chips starting in late 2015 but is still researching e-beam as an alternative.
Company executives detailed the new processes and how they aim to get there at an annual symposium here. They also provided an update on their work on 3-D chip stacks and their ongoing ramp of today’s 28-nm process node.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Samsung Edges TSMC in 10 nm
- TSMC's R&D chief sees 10 years of scaling
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM
- Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation