Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Tvia Speeds Verification of Next-Generation Multi-Media Chips with Axis Systems' Xtreme
Tvia uses Xtreme verification system for early system integration
Sunnyvale, CA - May 22, 2002 - Axis Systems Inc. today announced that Tvia, Inc. (Nasdaq:TVIA), has purchased Axis Systems' Xtreme™ verification system and incorporated it into Tvia's design flow to speed the development of Tvia's CyberPro™ family of next-generation multi-media display processors.
The CyberPro processors merge multiple independent streams of audio, video, text, graphics and animation, and deliver high-quality output streams for display to devices such as enhanced televisions and emerging displays.
"To offer more features in our chips, we need to integrate and verify new and legacy IP from multiple sources," said Eli Porat, Tvia's president and chief executive officer. "Before using Xtreme, verifying the IP in our system was difficult and time-consuming; now, our turn-around time has improved from days to hours. We expect that Xtreme will continue to help us remain in front of the opportunity curve."
One of the challenges facing Tvia's design team was integrating third-party MPEG intellectual property (IP) with legacy multi-media designs into its next-generation processor. Using Xtreme, Tvia's SoC designers can run accelerated simulations and emulations to verify the integration of multiple IP from various sources, detect and isolate bugs, and perform system integration early in the design phase.
"Shortening time-to-market is critical in the multi-media convergence market, and we're thrilled that Xtreme gives Tvia a competitive edge," said Mike Tsai, Axis president and CEO. "With its CyberPro processor design, Tvia has demonstrated the power of Xtreme to integrate and debug IP from various sources."
Xtreme is based on Axis's patented ReConfigurable Computing (RCC) technology, which provides powerful debugging capabilities such as VCD-on-Demand and hot swapping. VCD-on-Demand saves the simulation history for an entire design, eliminating the need to re-simulate when a bug is found, which improves overall verification productivity. Hot swapping - switching from software simulation to accelerated simulation and emulation - gives designers the flexibility to debug their designs in a familiar software debugging environment while taking advantage of acceleration and emulation performance.
About Axis Systems
Axis Systems, Inc. offers high-performance verification platforms for the hardware and software development of complex electronic system and system-on-chip designs. Axis' products help customers increase confidence in new designs, improve overall verification productivity and shorten time to market. On a single system and with a unified design database, patented RCC technology provides software simulation, accelerated simulation, system emulation and hardware/software co-verification. Customers include the world's leading networking and multimedia companies. Axis is headquartered at 209 Java Drive, Sunnyvale, CA 94089. To learn more about Axis, visit www.axiscorp.com.
|
Related News
- Axis Systems' Xtreme Verification System Selected by Coolsand to Speed Development of Chips for Portable Multimedia Devices
- Movidia Licenses Arasan's SD/SDIO IP Core for Next-Generation Multi-Media SoC
- Magnum Semiconductor Selects Denali's Verification Software for Design of Next-Generation Digital Video Chips
- Axis Systems’ Xtreme Verification Tool Selected to Verify Hardware and Software for PMC-Sierra’s Next-Generation MIPS-based Processors
- Synopsys Expands the Industry's Highest Performance Hardware-Assisted Verification Portfolio to Propel Next-Generation Semiconductor and Design Innovation
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |