Xilinx and Sumitomo Electric Collaborate on Smarter Solutions that Reduce Network CapEx and OpEx Costs
Using Xilinx radio SmartCORE IP and Sumitomo Electric GaN power amplifier transistors helps customers achieve greater than 50 percent power efficiency
SAN JOSE, Calif. -- May 21, 2013 -- Xilinx, Inc. (NASDAQ: XLNX) today announced that Xilinx and Sumitomo Electric Industries, Ltd. are collaborating to bring smarter solutions to market. These solutions reduce CapEx and OpEx costs through the use of Sumitomo Electric's Gallium Nitride (GaN) power amplifier transistors and Xilinx® SmartCORE™ IP that result in higher radio unit efficiencies. Wireless system designers using Xilinx's SmartCORE IP can scale to support small cells to high-end macro cells, as well as active antenna systems (AAS), offering customers time-to-market advantages, lower development costs, high efficiency, lower SWaP (size, weight and power), and lower total cost.
Xilinx radio SmartCORE IP such as Digital Up and Down Converters (DUC/DDC), Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) IP cores, coupled with generation-ahead 28nm Zynq®-7000 All Programmable SoCs, offers customers a single-chip implementation of the entire digital radio in addition to board level control and calibration typically found in an external processor.
"By collaborating with Sumitomo Electric, we are able to provide our customers with a smarter solution that is scalable to support the needs of broadband microcells, and up to the highest performance multi-antenna broadband macros and AAS installations," said David Hawke, director of wireless product marketing at Xilinx. "Additionally, our radio IP, coupled with Sumitomo Electric's power amplifier transistors, allow OEMs to design equipment that ultimately save operator CapEx and OpEx, as well as reduce device cost and power."
The high breakdown voltage and saturation velocity characteristics of GaN devices make it an ideal candidate for high-power and high-temperature base station applications. The higher power density of GaN also allows for smaller devices, reducing size and cost.
"Sumitomo Electric's GaN-based power devices combined with Xilinx's SmartCORE IP will demonstrate the world's next generation of highly efficient solutions for the wireless market," said Nobu Kuwata, general manager of Technology and Marketing Strategy Department at Sumitomo Electric Device Innovations, Inc. "Sumitomo Electric is committed to developing the products necessary to meet the requirements of our customers offering smarter solutions."
Please visit the Sumitomo Electric booth (#2120) at the International Microwave Symposium 2013 (IMS) in Seattle on June 4-6, 2013 to see a live demonstration of the Sumitomo Electric GaN and Xilinx DPD IP core.
Availability
Visit the Sumitomo Electric website for technical detail and purchase information for its GaN power amplifier transistors. To learn more about the Xilinx radio IP, visit: http://www.xilinx.com/esp/wireless/refdes_listing.htm.
About Xilinx
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Xilinx and NXP Collaborate to Reduce CapEx and OpEx Costs of Wireless Infrastructure Radios
- Xilinx Targets Reduced OpEx and CapEx for Network Operators with Expanded FEC IP Core Offering
- Real Wireless Research Shows One Third Reduction for Private Network Infrastructure Cost Using AccelerComm 5G physical layer IP solution
- ARM, Applied Micro and Netzyn Collaborate on New NFV Platform to Reduce Operator Costs
- Xilinx Expands Market-Leading Automotive Silicon Portfolio With Spartan-6 FPGAs Optimized to Reduce System Cost
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |