Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
RDA Microelectronics Boosts Mobile Phone Performance with Arteris FlexNoC Interconnect IP
Interconnect fabric IP also improves time-to-market for new Smartphone processors
SUNNYVALE, Calif., May 28, 2013-- Arteris, Inc., the inventor and leading supplier of Network-on-Chip (NoC) interconnect IP solutions, today announced that RDA Microelectronics, Inc. has selected Arteris FlexNoC interconnect IP as the backbone SoC interconnect for its new wireless Systems-on-Chip (SoC) platforms.
As one of China's leading fabless semiconductor companies, RDA is committed to providing its mobile phone customers with the highest performing, most design-efficient wireless SoCs. The company recently evaluated the FlexNoC IP and found it eliminated routing congestion and eased timing closure. In addition, the FlexNoC's graphical user interface, automated design and verification flow enabled fast design turnaround and dramatically shortened time-to-market.
"The Arteris FlexNoC commercial SoC interconnect fabric IP meet the performance metrics established by our mobile phone customers," said Vincent Tai, chairman and CEO of RDA Microelectronics. "These results gave us the confidence to implement the solution in our critical Smartphone SoC platform. We have very high expectations and feel confident that Arteris will meet our needs."
"RDA's selection of the FlexNoC as their SoC interconnect is a significant achievement, and positions Arteris as the leading supplier of interconnect IP fabric within the fast-growing China market," said K. Charles Janac, President and CEO of Arteris. "Arteris NoC technology meets our customer's key criteria - performance, design verification and time to market - which translate to significant technological and economic benefits."
About Arteris
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster development of ICs, SoCs and FPGAs.
Founded by networking experts and offering the first commercially available Network-on-Chip IP products, Arteris operates globally with headquarters in Sunnyvale, California and an engineering center in Paris, France. Arteris is a private company backed by a group of international investors including ARM Holdings, Crescendo Ventures, DoCoMo Capital, Qualcomm Incorporated, Synopsys, TVM Capital, and Ventech. More information can be found at www.arteris.com.
About RDA Microelectronics
RDA Microelectronics is a fabless semiconductor company that designs, develops and markets wireless Systems-on-Chip and radio-frequency semiconductors for cellular, connectivity and broadcast applications. The Company's product portfolio currently includes baseband, radio-frequency front end modules, power amplifiers, transceivers, Bluetooth Systems-on-Chip, Wi-Fi, Bluetooth and FM combo chips, FM radio receivers, set-top box tuners, analog mobile television receivers, CMMB mobile television receivers, walkie-talkie transceivers and LNB satellite downconverters. For additional information, please see the Company's website at http://www.rdamicro.com.
|
Arteris Hot IP
Related News
- Spreadtrum Adopts Arteris FlexNoC Interconnect IP for Mobile Phone Processor and Baseband Systems-on-Chip
- Beijing Nufront Selects Arteris FlexNoC Interconnect IP and C2C for Mobile Phone Systems on Chip (SoC)
- Arteris FlexNoC Interconnect IP Licensed by Core Logic for Mobile and Multimedia Processors
- Arteris FlexNoC Interconnect IP Licensed by Freescale for i.MX Applications Processors
- Arteris Interconnect IP Solution Selected by Samsung for Mobile SoC Deployment
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |