Cirrus signs foundry deal with Hynix in move to expand IC outsourcing
![]() |
Cirrus signs foundry deal with Hynix in move to expand IC outsourcing
By Semiconductor Business News
May 24, 2002 (12:00 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020524S0059
FREMONT, Calif. -- Cirrus Logic Inc. here today expanded its roster of silicon foundry providers, announcing a deal with South Korea's Hynix Semiconductor Inc. Cirrus signed a multi-year, renewable agreement establishing Hynix as a volume supplier of CMOS-based chip manufacturing services. Fremont-based Cirrus will have access to Hynix's portfolio of mixed-signal technologies. "Hynix's cost-conscious business model and advanced manufacturing services will help Cirrus Logic expand its leadership position in the digital entertainment revolution," said David Aldredge, vice president of fabrication operations at Cirrus. Cirrus also has arrangements with other foundry providers. The company has signed deals with Singapore's Chartered Semiconductor Manufacturing Pte. Ltd., China's Central Semiconductor Manufacturing Co. Ltd. and Taiwan's United Microelectronics Corp
Related News
- SST and SK hynix system ic Partner to Expand Availability of Embedded SuperFlash Technology
- Apple, TSMC to expand foundry ties
- Hynix Standardizes on SpringSoft's Verification Enhancement and Custom IC Design Solutions
- India's Wipro expands IC-design services by striking foundry deal with UMC
- SkyWater to Acquire Infineon's Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |