North American Semiconductor Equipment Industry Posts May 2013 Book-to-Bill Ratio of 1.08
SAN JOSE, Calif. — June 20, 2013 — North America-based manufacturers of semiconductor equipment posted $1.32 billion in orders worldwide in May 2013 (three-month average basis) and a book-to-bill ratio of 1.08, according to the May EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.
The three-month average of worldwide bookings in May 2013 was $1.32 billion. The bookings figure is 12.5 percent higher than the final April 2013 level of $1.17 billion, and is 18.1 percent lower than the May 2012 order level of $1.61 billion.
The three-month average of worldwide billings in May 2013 was $1.22 billion. The billings figure is 12.6 percent higher than the final April 2013 level of $1.09 billion, and is 20.5 percent lower than the May 2012 billings level of $1.54 billion.
“The SEMI Book-to-Bill continues to show steady improvement as the ratio remains at or above parity for the fifth consecutive month,” said Daniel P. Tracy, senior director of Industry Research and Statistics at SEMI. “The spending outlook for the year is improving as foundries continue to invest in advanced technologies and NAND manufacturers plan to increase spending on equipment.”
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
| Billings | Bookings | Book-to-Bill |
December 2012 | 1,006.1 | 927.4 | 0.92 |
January 2013 | 968.0 | 1,076.0 | 1.11 |
February 2013 | 974.7 | 1,073.5 | 1.10 |
March 2013 | 991.0 | 1,103.3 | 1.11 |
April 2013 (final) | 1,086.3 | 1,173.9 | 1.08 |
May 2013 (prelim) | 1,223.3 | 1,321.2 | 1.08 |
Source: SEMI, June 2013
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the Equipment Market Data Subscription (EMDS).
SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
|
Related News
- North American Semiconductor Equipment Industry Posts April 2013 Book-to-Bill Ratio of 1.08
- North American Semiconductor Equipment Industry Posts May 2016 Book-to-Bill Ratio of 1.09
- North American Semiconductor Equipment Industry Posts May 2015 Book-to-Bill Ratio of 0.99
- North American Semiconductor Equipment Industry Posts May 2014 Book-to-Bill Ratio of 1.00
- North American Semiconductor Equipment Industry Posts December 2013 Book-to-Bill Ratio of 1.02
Breaking News
- Keysight, Synopsys, and Ansys Deliver Radio Frequency Design Migration Flow to TSMC's N6RF+ Process Node
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |