Innovative Logic announced licensing of their USB 3.0 SuperSpeed OTG IP
Innovative Logic, San Jose – June 27, 2013 – Innovative Logic Inc.(Inno-Logic, www.inno-logic.com), leading provider of reusable standard based Intellectual Property (IP) and ASIC/FPGA design & verification services announced today the release of their USB3.0 OTG controller IP. After having great success with their USB3.0 device controller IP, Innovative Logic is announcing the arrival of their USB3 “On The Go” (OTG) controller IP. Innovative Logic is the first company to announce the release of USB3.0 OTG controller IP.
“The USB OTG supplement was introduced to USB3 specification to provide a low cost connectivity solution to consumer portable devices such as Smart phones, Tablets, Digital still camera, Digital music players etc. due to their ability to work both as Host and Peripheral. It removed the need of standard PC host for many applications. USB3.0 OTG brings in its very high Data rate. Together it gives immense advantage to portable devices.” says Dinesh Tyagi, President and CEO.
Innovative Logic’s USB3.0 OTG solution has gone through extensive pre and post silicon tests to ensure that it works seamlessly at customer end. Innovative Logic has also tested their IP using more than 8 PHY vendors and more than 4 VIP vendors globally.
Key Features
- Compliant with:
- USB3.0 specification
- OTG&EH3.0 specification
- USB3.0 PIPE interface
- Support 8/16/32 data bus width
- AXI, AHB, PLB Bus standards
- Support 32/64 bit data bus
- Supports RSP – Role Swap Protocol
- Supports Super Speed OTG communication with one or more devices
- Support USB3.0 power down modes
- Support Control, Bulk, Bulk Stream, Isochronous and Interrupt transaction
- Configurable up to 15 transmit and 15 receive endpoints apart from default endpoint
- Dynamically configurable Endpoint FIFO for optimum usage of memory
- Synchronous SRAM interface for FIFO
- Integrated DMA controller
- Verified using System Verilog based verification environment.
“Need of dynamically changing host and device capability always force chip vendors to move to OTG capability. As of now, we are relying on using host & device together as workaround. After this release, we can directly move seamlessly from USB2.0 OTG to USB3.0 OTG without any customization and limitations” said Dinesh Tyagi, President & CEO.
USB3.0 OTG IP is currently available for licensing worldwide. The IP is currently available in both soft IP and FPGA netlist formats. The soft IP deliverables include RTL source code, test vectors, scripts and User Manual. The FPGA netlist deliverables include test vectors, scripts, User Manual along with the FPGA netlist.
For details about the licensing USB 3.0 OTG IP, please contact at sales@inno-logic.com or call our nearest Design Center. For details, visit our website at www.inno-logic.com.
Innovative Logic is the leading provider of reusable standard based IP solutions as well as high quality and reliable design services in ASIC, FPGA, and Embedded Systems Design. Innovative Logic has a world class team of engineers who have successfully executed different projects using the latest tools and the technologies.
|
Related News
- Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0/2.0 Dual Role IP Solution
- Innovative Logic Inc. and M31 Technology Introduce a USB-IF Certified Complete SuperSpeed USB 3.0 IP Solution
- Innovative Logic announces free licensing of their USB 3.0 SuperSpeed IP
- Genesys Logic Showcases USB 3.0 Family of Products at CES 2011
- SuperSpeed USB Adoption Slowed by PC Core Logic Integration, but Future Is Still Bright
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |