CEVA licenses Flagship DSP to Renesas Electronics for Next-Generation Intelligent Transport Systems
Low power CEVA-XC DSP provides powerful software-defined radio platform for baseband processing in broadband wireless communication applications
MOUNTAIN VIEW, Calif., July 9, 2013 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Renesas Electronics Corporation, a premier provider of advanced semiconductor solutions has licensed the CEVA-XC DSP to power a new generation of wireless communications System-on-Chips (SoCs) for Intelligent Transport Systems (ITS). The programmable nature of the CEVA-XC will enable Renesas to create a software-defined radio (SDR) SoC offering ultra-high performance and requiring minimal power consumption.
"The CEVA-XC DSP delivers outstanding performance and flexibility required for wireless communication products for the ITS market together, with the ability to adapt the SoC to future standards through software upgrades," said Tatsuya Nishihara, Vice President, Chief of Automotive Solutions Business Division, 1st Solution Business Unit of Renesas Electronics Corporation. "Furthermore, the silicon-based CEVA-XC development platform provides our engineers with a real-time environment to develop software, significantly reducing the development efforts and costs associated with our wireless SoC."
"Flexibility through software and low power consumption are key pillars of our CEVA-XC DSP framework, enabling our customers to create powerful baseband processors for any communications requirements," said Gideon Wertheizer, CEO of CEVA. ""We are very pleased to add Renesas to our long list of customers who can leverage this value proposition to deliver industry-leading products based on our DSPs. Renesas' software-defined radio approach based on our DSP will enable them to achieve significant differentiation in the market place with their SoC."
The CEVA-XC family of DSPs is designed specifically to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high-performance Software Defined Radio multimode solutions. It supports multiple air interfaces for various applications such as multimode cellular baseband, connectivity, digital broadcast, satellite and smart grid. For more information, visit http://www.ceva-dsp.com/CEVA-XC-Family.html.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in over 1.1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
|
Ceva, Inc. Hot IP
Related News
- CEVA's High-Performance DSP Solution to Power Renesas' Next-Generation Automotive SoC
- Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip
- Atmel Licenses Industry-Leading CEVA-X DSP And System Platform To Power Next-Generation High Performance Storage Applications
- Renesas Electronics Develops 28nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures
- Renesas Electronics and TSMC Announce 28nm MCU Collaboration for Next-Generation Green and Autonomous Vehicles
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |