eASIC Raises $23.5M of Growth Capital
Financing to fund global expansion and fulfill fast-growing product demand
Santa Clara, CA – September 9, 2013 – eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ devices today announced that it has closed a $23.5M growth capital financing. The funding includes investment from Khosla Ventures, Kleiner Perkins Caufield and Byers, Crescendo Ventures, Seagate Technology and Evergreen Partners. eASIC® will use the capital to fund expansion of its US and European development organizations and to provide working capital associated with the fast-growing demand for its Single Mask Adaptable ASIC devices.
"eASIC has become the go-to provider for cost effective, mass customization devices", said Ronnie Vasishta, President and CEO of eASIC. "Our success in wireless infrastructure and the storage market, coupled with several new key design wins in the high-volume automotive market drove the targeted $20M round to be oversubscribed to $23.5M. This significant funding by leading venture firms and a strategic partner positions us well to expand our development and customer organizations as we execute on our recent wins and broad customer pipeline."
"The convergence of eASIC’s unique technology, the demand for mass customization combined with the need for low-cost and fast time to market solutions is creating an unprecedented opportunity for eASIC to emerge as the de facto solution for custom silicon platforms", said Mike Kourey, a Partner at Khosla Ventures. "With this growth capital financing, eASIC and its strong leadership team is in a position to fully execute on its strategy and fulfill the demand of its broadening base of customers and platforms."
About eASIC
eASIC® is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC™ devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology (NASDAQ:STX) and Evergreen Partners. For more information on eASIC please visit www.easic.com.
|
Related News
- AI Chip Company Syntiant Raises $55 Million to Accelerate Growth
- Blu Wireless raises $16.6 million in growth funding round for 5G applications
- Valens Raises $60M to Boost Growth, Innovation in Automotive Industry
- Netspeed Raises $10M in Series C Funding Led by Intel Capital to Bring Machine learning to SoC design and architecture
- Aquantia Raises $37 Million in Growth Capital Targeting the Billion Ethernet Port Opportunity in Data Center & Enterprise
Breaking News
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Leveraging Cryogenics and Photonics for Quantum Computing
- Kalray Joins Arm Total Design, Extending Collaboration with Arm on Accelerated AI Processing
- Credo at TSMC 2024 North America Technology Symposium
- Cadence Reports First Quarter 2024 Financial Results
Most Popular
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
E-mail This Article | Printer-Friendly Page |