SAN JOSE, CA, Oct 21, 2013 -- Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that Taiwan-based VIA Technologies has selected the Cadence(R) Tensilica(R) HiFi Audio/Voice DSP (digital signal processor) for a system-on-chip (SOC) design for set top box, tablets and mobile devices.
"We needed a very low power audio DSP with a wide range of software codecs, so we selected the Cadence Tensilica HiFi/Voice Audio DSP," Michael Shiuan, vice president of Engineering, VIA Technologies. "This low power DSP fits well in our advanced SOC architecture and product lines. Our design-in time is also minimized due to the robustness of the complete codec support."
Cadence Tensilica HiFi Audio/Voice DSPs are the leading licensable audio DSP IP cores, licensed by more than 50 customers including many of the top 10 semiconductor manufacturers and leading system OEMs. The HiFi Audio/Voice DSPs support over 100 audio and voice codecs with very efficient processing at low power. Learn more at: http://www.tensilica.com/products/audio
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.