Agere licenses BIST technology from LogicVision to reduce test costs
![]() |
Agere licenses BIST technology from LogicVision to reduce test costs
By Semiconductor Business News
June 4, 2002 (5:52 p.m. EST)
URL: http://www.eetimes.com/story/OEG20020604S0052
SAN JOSE -- LogicVision Inc. today announced that Agere Systems Inc. has licensed its built-in-self-test (BIST) technology for use in its chip lines. Under the agreement, Agere will use LogicVision's Embedded Test 4.0 for its hierarchical test design, debug and seamless integrated manufacturing test infrastructure. LogicVision's embedded test solution allows integrated circuit designers to embed test functionality into a semiconductor design. As part of the multi-year agreement, Agere will deploy Embedded Test 4.0 to its design groups, delivering time-to-market value by reducing design-for-test implementation and verification time.
|
Related News
- Q-Star Test nv joins LogicVision Ready™ partner program to help further reduce test costs and enhance yield
- Synopsys Advances Test Fusion Technology with Test Points to Reduce Manufacturing Costs and Boost Quality
- Synopsys Announces DFTMAX Ultra to Significantly Reduce Silicon Test Costs
- Mentor Graphics Acquires LogicVision; Unites BIST, ATPG and Test Pattern Compression Technologies
- TranSwitch(R) Corporation Licenses MIPS32(R) 4KEc(R) Pro Processor Core to Reduce Development Costs, Speed Time-to-Market
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |