Tality Showcases Path to Accelerate IC Design at Supercomm 2002
Leading Design and IP Provider Displays Its Innovation With Range of Complex IC Solutions
ATLANTA, GA - SUPERCOMM 2002 (Booth #22224) - June 4, 2002 - Tality Corporation will showcase four leading IC solutions at the 2002 Supercomm Conference. Providing world-class design services and Intellectual Property (IP), Tality is teaming with leading technology companies to bring innovative communications IC products to market. The following demonstrations will be on display at the conference:
SERDES ARCHITECTURE EXCEEDS ETHERNET STANDARDS SPECIFICATIONS
- Tality's SerDes Architecture is smaller and uses less power than competing solutions.
- Features high-speed data transfer between two SerDes test chips with the fidelity of transmitted signal clearly demonstrated using Eye Diagrams.
- Demonstrates functional silicon of its Infiniband 2.5 Gbit/s SerDes IP fabricated in TSMC's 0.18µm generic logic CMOS process. The silicon is assembled in a low-cost, bonded BGA package. The silicon will be demonstrated using two test chips, each containing four SerDes channels, mounted on test PCBs.
In 2001, eMagin received a Product-of-the-Year Award from the editors of Electronic Products magazine for the development of its SVGA+ (852x600 color pixels) high-resolution active matrix OLED microdisplay. eMagin's Microdisplay technology is used in small, optically-viewed devices such as video headsets, medical microsurgery headsets, camcorders and camera viewfinders.
- The SVGA+ active matrix OLED provides an integrated analog interface microdisplay solution.
- Tality's IC accepts dc-coupled R, G, B inputs with separate external vertical and horizontal synchronization inputs, in accordance with the VESA and VSIS standard.
- Tality delivered its MAC months ahead of its nearest competitor. Tality's integrated RF IC solution for 802.11 offers customers an accelerated path to bringing WiFi products to the market.
- The MAC features a synthesizable core and protocol stack for the implementation of 802.11a, 802.11b, and dual-mode systems.
- Designed from the ground up as a highly optimized, deeply integrated system, for maximum data throughput with minimum processor load and chip power consumption.
- Tality will shortly sign-up its fifth licensee for this technology.
- Recognizes Tality as one of the five IP providers that have been accredited by NIST Cryptographic Module Validation.
- Meets the NIST standards - Tality's Triple DES (Federal Information Processing Standard 81) and Secure Hashing (Federal Information Processing Standard 180-1) IP have been validated by NIST.
- Demonstration showcases the accredited encryption by encoding/decoding data moving through a network.
Tality Corporation, a subsidiary of Cadence Design Systems, Inc. (NYSE:CDN), is the world's largest electronic product development outsourcing provider. Leading and emerging technology companies around the globe leverage Tality's engineering services and intellectual property for the design of complex electronic systems and integrated circuits. Tality is headquartered in San Jose, California. For more information about Tality, please visit us at www.tality.com.
|
Cadence Design Foundry Hot IP
Related News
- Aware, Inc. showcases DSL technology leadership at SuperComm 2002
- Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation
- IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
- Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development
Breaking News
- Comcores Announces Availability of its Ultra-Compact Ethernet TSN End Station Controller IP for Automotive Networks
- Now Gelsinger is gone, what is Intel's Plan B?
- X-FAB Releases Embedded Flash Solution on its 110nm Automotive BCD-on-SOI Technology
- Kudelski IoT and PUFsecurity Combine IoT Security Strengths to Meet the Challenges of Increasing Global Regulation
- Alphawave Semi Joins UALink™ Consortium to Accelerate High-Speed AI Connections
Most Popular
- Intel Announces Retirement of CEO Pat Gelsinger
- Tenstorrent closes $693M+ of Series D funding led by Samsung Securities and AFW Partners
- Lip-Bu Tan quit Intel board after "differences" with CEO, says Reuters
- MIPS Releases P8700, Industry's First High-Performance AI-Enabled RISC-V Automotive CPU for ADAS and Autonomous Vehicles
- Arteris Deployed by Menta for Edge AI Chiplet Platform
E-mail This Article | Printer-Friendly Page |