Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
Tality Showcases Path to Accelerate IC Design at Supercomm 2002
Leading Design and IP Provider Displays Its Innovation With Range of Complex IC Solutions
ATLANTA, GA - SUPERCOMM 2002 (Booth #22224) - June 4, 2002 - Tality Corporation will showcase four leading IC solutions at the 2002 Supercomm Conference. Providing world-class design services and Intellectual Property (IP), Tality is teaming with leading technology companies to bring innovative communications IC products to market. The following demonstrations will be on display at the conference:
SERDES ARCHITECTURE EXCEEDS ETHERNET STANDARDS SPECIFICATIONS
- Tality's SerDes Architecture is smaller and uses less power than competing solutions.
- Features high-speed data transfer between two SerDes test chips with the fidelity of transmitted signal clearly demonstrated using Eye Diagrams.
- Demonstrates functional silicon of its Infiniband 2.5 Gbit/s SerDes IP fabricated in TSMC's 0.18µm generic logic CMOS process. The silicon is assembled in a low-cost, bonded BGA package. The silicon will be demonstrated using two test chips, each containing four SerDes channels, mounted on test PCBs.
In 2001, eMagin received a Product-of-the-Year Award from the editors of Electronic Products magazine for the development of its SVGA+ (852x600 color pixels) high-resolution active matrix OLED microdisplay. eMagin's Microdisplay technology is used in small, optically-viewed devices such as video headsets, medical microsurgery headsets, camcorders and camera viewfinders.
- The SVGA+ active matrix OLED provides an integrated analog interface microdisplay solution.
- Tality's IC accepts dc-coupled R, G, B inputs with separate external vertical and horizontal synchronization inputs, in accordance with the VESA and VSIS standard.
- Tality delivered its MAC months ahead of its nearest competitor. Tality's integrated RF IC solution for 802.11 offers customers an accelerated path to bringing WiFi products to the market.
- The MAC features a synthesizable core and protocol stack for the implementation of 802.11a, 802.11b, and dual-mode systems.
- Designed from the ground up as a highly optimized, deeply integrated system, for maximum data throughput with minimum processor load and chip power consumption.
- Tality will shortly sign-up its fifth licensee for this technology.
- Recognizes Tality as one of the five IP providers that have been accredited by NIST Cryptographic Module Validation.
- Meets the NIST standards - Tality's Triple DES (Federal Information Processing Standard 81) and Secure Hashing (Federal Information Processing Standard 180-1) IP have been validated by NIST.
- Demonstration showcases the accredited encryption by encoding/decoding data moving through a network.
Tality Corporation, a subsidiary of Cadence Design Systems, Inc. (NYSE:CDN), is the world's largest electronic product development outsourcing provider. Leading and emerging technology companies around the globe leverage Tality's engineering services and intellectual property for the design of complex electronic systems and integrated circuits. Tality is headquartered in San Jose, California. For more information about Tality, please visit us at www.tality.com.
|
Cadence Design Foundry Hot IP
Related News
- Aware, Inc. showcases DSL technology leadership at SuperComm 2002
- Siemens expand collaboration with AWS to help IC and electronics design customers accelerate innovation
- IC Manage Partners with Library Technologies to Accelerate Library Characterization by 100x in the Cloud
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
- Tower Semiconductor and Cadence Expand Collaboration to Accelerate Automotive IC Development
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |