Gartner Bullish on Network-on-Chip Technology, Names Arteris as the Leader
Complex system-on-chip (SoC) devices will increasingly require FlexNoC fabric IP
CAMPBELL, Calif., Nov. 20, 2013 -- Arteris, Inc., the inventor and leading supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, today announced that analyst firm Gartner, Inc. gave network-on-chip technology a "high" benefit rating in its 2013 Hype Cycle for Semiconductors and Electronics Technologies report. The annual review represents Gartner's view of some of the most interesting and significant semiconductor and electronics technologies. These technologies are considered underlying enablers for applications including PCs, mobile devices and servers. The report reflects the views of Gartner's analysts as well as industry input.
According to Gartner's analysis, several drivers are boosting development of this technology. NoC technology leads to faster throughput and reduced error rates since parallel and simultaneous communication is coordinated between chip resources. NoC technology also facilitates more effective reuse of functional blocks, potentially lowering design costs, creating more flexible design environments, and improving chip turnaround time.
In his report, Jim Tully, Vice President and Distinguished Analyst with Gartner, Inc., states Gartner believes that companies involved in advanced SoC design should seriously consider NoC technology. He believes this technology has seen increased adoption by leading SoC firms, prompting Gartner to advance NoC further along in this year's Hype Cycle. According to his analysis, early adopters will benefit from this technology in the next two years.
"Inventing a new technology is never easy – especially in the rapidly advancing semiconductor industry," said K. Charles Janac, President and CEO of Arteris. "Gartner's recognition of NoC technology, and its impact on the market, is a testament to our efforts. And our customers' decision to aggressively deploy the Arteris FlexNoC interconnect IP provides further validation."
About Arteris
Arteris, Inc. provides Network-on-Chip interconnect IP and tools to accelerate System-on-Chip semiconductor (SoC) assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as Samsung, Altera, and Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.
|
Arteris Hot IP
Related News
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- Mirabilis Design Adds System-Level Modelling Support for Industry-Standard Arteris FlexNoC and Ncore Network-on-Chip IPs
- Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
- Arteris Network-on-Chip Tiling Innovation Accelerates Semiconductor Designs for AI Applications
- Fraunhofer IESE Partners With Arteris To Accelerate Advanced Network-on-chip Architecture Development for AI/ML Applications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |