English
Sckipio Technologies Completes $10M Investment Round to Create G.fast Modem Chips
G.Fast’s 1Gbps Broadband Quickly Becoming a Reality
Tel Aviv, Israel – December 11, 2013 − Sckipio Technologies today announced completion of a $10M investment from four venture funds − Gemini Israel Ventures, Genesis Partners, Amiti Capital, and Aviv Ventures − to build ultra-high speed G.fast broadband modem semiconductors. These leading U.S. and Israeli investors are betting that Sckipio will become the leading chip company to enable G.fast – the new 1Gbps broadband standard soon to be announced by the ITU. Sckipio is actively working with multiple tier-1 telcos globally to address the pent-up demand for affordable ultra-fast broadband using G.fast.
“Sckipio is poised to be the leader in G.fast,” said David Baum, co-founder and CEO of Sckipio Technologies. “The standard is now ready and so are we. We’ve got a complete team with the relevant expertise in G.fast and the capital needed to deliver the right G.fast solutions quickly.”
Sckipio brings a deep understanding of the new ITU recommendation. As an active member of the G.fast ITU study group, Sckipio provided over 20% of all the contributions to the G.fast recommendation.
“G.fast is the best hope for telcos to affordably deliver 1Gbps to consumers,” said Oliver Johnson, CEO of Point Topic, a leading broadband market research firm. “We expect G.fast to be broadly deployed quickly because telcos need an effective alternative to cable and G.fast appears to have everything these telcos need to succeed.”
G.fast provides several key advantages over existing broadband technologies. The standard:
- Provides up to 1 Gbps of broadband access over existing phone lines for up to 250 meters
- Lowers the cost to deploy fiber-like speeds by as much as 90%
- Speeds up Telco take rates by eliminating home installations and installer-induced delays
- Simplifies deployments by using remote power feed, which eliminates complex permissions to power FTTdp field units
- Delivers Telcos 3-4x faster ROI when delivering next-generation broadband solutions
- Consumes comparatively little power, making it both green and low-cost to deploy
- Provides flexible upstream/downstream partitioning of available bandwidth allowing support for new and advanced broadband services
“We expect G.fast-based solutions to ship in 2014,” said Baum.
|
||||||
Related News
- Nanochip Secures $10 Million in Series C Funding Led by Intel Capital; Investment Round to Provide for Commercialization of Ultra-High-Capacity Removable Storage Chips
- Codasip Secures $10M in Series A Financing to Expand RISC-V Processor Technology Offerings
- Gfast Leader Sckipio Raises $50M to Date with New $10M Funding
- Efinix Completes $9.5M Funding Round
- Mobile Sensor Technology Company Acconeer AB Closes $7M Investment Round
Breaking News
- Synopsys Achieves More Than 250 Design Wins with DesignWare IP on TSMC 7nm FinFET Process
- Mobiveil's GPEX IP with PCI Express 5.0 technology support to be made available in End Point, Root Complex, Dual mode and Switch configurations with Configurability, Reliability and Serviceability
- Arasan Announces its Total eMMC IP Solution on TSMC 7nm Process Technology
- Analog Bits Showcases PCIe Gen2 / Gen3 / Gen4 Reference Clock PHY Design Kits Available on TSMC 7nm / 12nm / 16nm / 22nm process technology
- Arteris IP FlexNoC Interconnect Licensed by Samsung's System LSI Business for Digital TV Chips
Most Popular
- ON Semiconductor and GLOBALFOUNDRIES Partner to Transfer Ownership of East Fishkill, NY 300mm Facility
- Synopsys Achieves More Than 250 Design Wins with DesignWare IP on TSMC 7nm FinFET Process
- Graphcore CEO Touts 'Most Complex Processor' Ever
- Machine Learning on DSPs: Enabling Audio AI at the Edge
- RISC-V, DARPA Advance Security
|
E-mail This Article | 
|
|
Printer-Friendly Page |