Xilinx Celebrates 30 Years, 3500 Patents, and 60 Industry Firsts
SAN JOSE, Calif., Feb. 13, 2014 -- Xilinx, Inc. (NASDAQ: XLNX) celebrates 30 years of technology leadership. With over 3,500 patents and 60 industry firsts, Xilinx is known for its historic achievements including the introduction of the first FPGA and the inception of the fabless model. Recent innovations have transformed Xilinx from its programmable logic heritage to an 'All Programmable' company, creating and integrating 'All' forms of hardware, software, digital, and analog programmable technologies into its All Programmable FPGAs, SoCs and 3D ICs. These devices combine the value of programmable systems integration with embedded intelligence and flexibility, enabling the rapid development of highly programmable and smarter systems.
"This is a milestone year as we celebrate 30 years of technology leadership, industry firsts and outstanding corporate achievements," said Moshe Gavrielov, President and CEO of Xilinx. "Xilinx is widely recognized for creating new innovative technology that pushes the electronics industry forward and serving our community in the arts, education, health, and social services. I look forward to celebrating further achievements with the Xilinx family in the years to come."
Xilinx® devices can be found in a broad range of applications including Mars probes, robotic surgery systems, wired and wireless networking infrastructure, high definition video cameras and displays, and industrial manufacturing and automation equipment. In the future, Xilinx All Programmable devices will enable the realization of next generation smarter systems, which include real time analytics of data and images, intelligent connected control, more optimized utilization of scarce resources, and higher safety and security. Future applications include Software Defined Networks (SDN) for both wired carriers and data centers, Self Organizing Networks (SON) for wireless infrastructure, Smart Grid and Wind Turbines for renewable energy, Machine Vision and Control coupled with Machine to Machine (M2M) Communication for smarter factories, Ultra High Definition (4K/2K) video infrastructure, and Advanced Drivers Assistance and Augmented Reality platforms for the next generation of smart automobiles.
Today, over 3,400 Xilinx employees worldwide join forces to evolve and actively transform the company and its technology portfolio to shape the future. Learn more at http://www.xilinx.com/30th-anniversary.
About Xilinx
Xilinx is the world's leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Dolphin Integration celebrates its 30th anniversary... A new wind is blowing on the enterprise ushering it to success over the next 30 years!
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- 2025 RISC-V CON: Andes Technology Celebrates 20 Years, Bringing Together Innovators, Engineers, and Ecosystem Leaders
- Flex Logix Celebrates 10 Years of Success and Innovation
- DCD celebrates 25 years
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |