Ultra-low power 32 kHz RC oscillator designed in GlobalFoundries 22FDX
NGCodec Licenses H.265/HEVC Encoder IP core to Leading Fabless Semiconductor Company
NGCodec H.265/HEVC Product called ‘Harrier’ is available for license
SAN JOSE, Calif. -- Feb. 19, 2014 -- NGCodec, an emerging company in silicon video Intellectual Property (IP), reports that it has signed a royalty bearing license agreement with a fabless semiconductor company for its next-generation H.265/HEVC encoder IP core called ‘Harrier’.
Harrier provides 4K resolution 60 frames per second performance at 10-bit per pixel. The design is optimized for low power consumption, high compression efficiency and low memory bandwidth.
“Harrier is capable of providing 1 frame of latency glass to glass over WiFi networks enabling the next generation of 4K interactive applications like gaming and docking stations” said Oliver Gunasekara CEO of NGCodec.
About NGCodec
NGCodec is a startup based in Silicon Valley creating video codec silicon Intellectual Property. The founders have extensive experience developing video codec IP, FPGAs and SoC’s. The team is focused on the new H.265/HEVC codec. The company was founded in 2012. NGCodec licenses its silicon IP technology to semiconductor manufacturers and OEMs. NGCodec.com
|
Related News
- Chips&Media Licenses HEVC/H.265 Decoder Core to a Leading Fabless Semiconductor Company
- AMPHION targets DAC 2016 to demonstrate compact HEVC/H.265 hardware decoder IP using H.265 bitstreams from encoder IP innovator NGCodec
- NGCodec and Xilinx Demonstrate H.265/HEVC Video Encoder IP at NAB 2016
- NGCodec demonstrates its H.265/HEVC Intra encoder on a Kintex-7 FPGA in the Xilinx booth at NAB Show
- Apical and NGCodec Announce H.265/HEVC Encoder with Region Of Interest Optimization via Object Tracking
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |