Cadence Licenses Tensilica ConnX BBE16 DSP to GCT Semiconductor
SAN JOSE, Calif. -- Feb 26, 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that GCT Semiconductor, Inc. licensed the Cadence® Tensilica® ConnX BBE16 digital signal processing (DSP) core for a next-generation chipset targeting mobile applications. The Tensilica DSP core offers high computation throughput in a small and very low power footprint, coupled with its extensive DSP core roadmap to meet future device computation requirements.
“Using programmability to implement 4G and multi-standard baseband modem functionality can accelerate time-to-market,” said Alex Sum, vice president of sales and marketing at GCT Semiconductor. “We are pleased to be working with Cadence to further advance our LTE chipsets. Using the Tensilica ConnX BBE16 DSP core allows chip makers to develop a product that meets the cost and power requirements. It also facilitates a tight integration of existing hardware blocks and the flexibility to tune the modem via software.”
The Tensilica ConnX BBE16 DSP core is a very efficient 16-MAC (multiply-accumulate) DSP core that has been optimized for OFDM-based wireless communication modem. It is fully programmable in C, eliminating the need for assembly coding found in other DSPs and also enables easier software development and maintenance.
For more information about the Tensilica ConnX BBE16 DSP, visit http://ip.cadence.com/ipportfolio/tensilica-ip/comms-dsp.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution
- Dialog Semiconductor Licenses Cadence's Industry-Leading Tensilica Hifi Audio/Voice DSP IP
- Renesas Licenses Cadence' Tensilica ConnX D2 DSP for Next-Generation IoT Chip
- Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
- New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |