Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
6-core 16nm FinFET ARM Cortex-A57 chips spotted in the wild
MWC 2014: Not just one, a full wafer of them fresh from the oven
Charlie Demerjian, SemiAccurate
Mar 3, 2014
What do you get when you put a 6-core ARM A57 on TSMC’s 16nm FinFET process? A lot of pretty pictures and a really big bunch of test chips to play with too.
At MWC last week, SemiAccurate spotted a nice A57 wafer hidden away in the ARM booth. Not much was said about it other than 16nm, TSMC, and A57 cores all of which, “Taped-out February, 2014″. That means it is as fresh tasting as it is pretty.
If you look at the wafer below, it is pretty obvious that there are six cores on the die plus a bunch of other test structures. This is a test chip after all, and the purpose is to optimize the A57 core for the upcoming process, and given the time from tape-out, it is hot from the oven. This means the work on the process is still ongoing and likely far from done.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- ARM and Cadence Partner to Implement Industry's First Cortex-A57 64-bit Processor on TSMC 16nm FinFET Process
- ARM and TSMC Tape-Out First ARM Cortex-A57 Processor on TSMC's 16nm FinFET Technology
- MediaTek to Stay with TSMC for Finer-Node Chips
- Memoir Systems' High Performance Renaissance Memories Available for ARM 16nm FinFET Physical IP
- ARM Announces POP IP for Cortex-A50 Series Processors on TSMC 28nm HPM and 16nm FinFET Processes
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation