inSilicon Inks Pact with Agilent to Provide Certified Hi-Speed USB 2.0 PHY for SOC Designs

USB 2 PHY Fulfills Connectivity Needs for Demanding PC Peripheral Applications

San Jose, CA, June 18, 2002 - inSilicon Corporation (Nasdaq: INSN) -- a leading provider of connectivity intellectual property (IP) technology for complex systems-on-chip (SOC) -- today announced that Agilent Technologies has signed an agreement for inSilicon to supply USB 2.0 PHY IP to Agilent's Semiconductor Products Group.

Certified by the USB Implementer's Forum, inSilicon's USB 2 PHY is a complete mixed-signal semiconductor IP solution designed for single-chip Hi-Speed USB 2.0 integration in both device and host applications. The USB 2 PHY integrates high-speed, mixed-signal, custom CMOS circuitry in compliance with the industry-standard UTMI Specification. USB 2 PHY technology supports the USB 2.0 480-Mbps protocol and data rate, and is backward compatible with the USB 1.1 legacy protocol at 1.5 and 12 Mbps.

The inSilicon/Agilent agreement defines foundry process ports beginning with inSilicon providing their Hi-Speed USB 2.0 PHY targeted to a 0.13-micron process. In the future, as more advanced semiconductor processes become available, the agreement provides for the relationship to be extended.

"We're seeing increased customer interest in the USB 2.0 high-speed interconnect standard," said Jeff Henderson, vice president and general manager of Agilent's Hard Copy Division. "We're confident that inSilicon will help us provide Agilent customers with a superior USB 2.0 connectivity solution that is certified to be interoperable."

We're pleased to see increased industry adoption of Hi-Speed USB 2.0 as demonstrated by this agreement between InSilicon and Agilent," said Jason Ziller, chairman of the USB-IF and Intel technology initiatives manager. "Consumers realize the performance benefits of Hi-Speed USB 2.0 in printers, CD and DVD burners, scanners, cameras and hard drives."

"Agilent's decision to choose our USB 2 PHY for their USB 2.0 connectivity needs validates the robustness of our product," said Xerxes Wania, vice president of mixed-signal business of inSilicon Corporation. "This partnership allows Agilent to focus its engineering resources on other aspects of their system-level chip designs, resulting in lower costs and faster time to market."

About inSilicon
inSilicon Corporation is a leading provider of connectivity semiconductor intellectual property used by semiconductor and systems companies to design systems-on-chip that are critical components of innovative wired and wireless products. inSilicon's technology provides customers faster time-to-market, reduced risk, and lower development cost. The company's broad portfolio of analog and mixed-signal products and enabling connectivity technologies, including USB, PCI, Ethernet, IEEE-1394, JPEG, and Java™ Accelerators are used in a wide variety of markets encompassing communications, consumer, computing, multimedia, and office automation.

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