NEC uses eASIC to Optimize iPasolink Microwave Products

Santa Clara, CA – April 14th, 2014 – eASIC® Corporation, a provider of Single Mask Adaptable ASIC™ devices today announced that NEC Corporation, a provider of leading solutions in the microwave backhaul market, is using eASIC’s Nextreme-2 product to optimize the performance and power of key functionality in their iPasolink backhaul products.

The rapidly growing microwave backhaul market is becoming more power sensitive while at the same time requiring significant increases in performance. NEC are using the fast turnaround time and low power benefits of eASIC Nextreme-2 Single Mask Adaptable ASIC devices to quickly enable differentiating advantages compared to other providers using FPGAs, as their products ramp to high volume with the global roll out of LTE.

“Our customers, the global operators, are constantly needing a reduction in their total cost of ownership, an increased performance envelope and a fast time to deployment of their microwave backhaul solutions” said Mr. Atsushi Noro, Deputy General Manager, Mobile Wireless Solutions Division. “eASIC’s Single Mask Adaptable ASIC devices are exactly the technology to enable us to meet these operator requirements. As microwave units are getting smaller, NEC is able to reduce total cost of ownership for the operators through the significant power advantages of the eASIC devices,” added Noro.

“Microwave backhaul is another market that demands custom silicon. The rapid growth in mobile devices has created large demand for next-generation backhaul links to support ever increasing bitrates, while reducing total ownership cost and power” said Ronnie Vasishta, President and CEO at eASIC Corporation. “We are excited to be shipping products to NEC to and play our part in helping NEC to meet their system performance and power reduction objectives, as FPGAs cannot any longer meet these critical requirements,” added Vasishta.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through a patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.

Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com.