Dual Port Register File Compiler (1 Read-Only Port, 1 Write-Only Port)
Rambus Signs Comprehensive License Agreement with Qualcomm
Agreement enables broad adoption of Rambus technologies for inclusion in Qualcomm chipsets
SUNNYVALE, Calif. – June 11, 2014 – Rambus Inc. (NASDAQ:RMBS) today announced that it has signed a comprehensive patent license agreement with Qualcomm Global Trading Pte. Ltd., a subsidiary of Qualcomm Incorporated. The agreement provides Qualcomm Incorporated and its subsidiaries with access to innovative patented memory, interface, and security technologies from Rambus. Other terms of the agreement are confidential.
“This agreement highlights our ongoing commitment to providing access to valuable memory and security technologies to industry leaders,” said Dr. Ron Black, president and chief executive officer at Rambus. “Engaging with Qualcomm with this agreement gives us an opportunity to collaborate with the broader industry to bring compelling solutions to the segment.”
In addition to certain high-performance, low-power memory innovations, this agreement provides Qualcomm Incorporated and its subsidiaries with access to patented security technologies developed by the Cryptography Research (CRI) division of Rambus. These security technologies include countermeasures for protecting integrated circuit systems on a chip (SoCs) against differential power analysis and other side channel attacks.
Rambus continues to innovate across memory architectures and security to meet the emerging requirements of device-driven segments like mobile and cloud. Working with industry leaders like Qualcomm positions Rambus’ inventions for broad adoption.
About Rambus
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.
|
Related News
- Rambus Signs Comprehensive Agreement with STMicroelectronics
- Rambus and SK hynix Extend Comprehensive License Agreement
- Rambus Signs License Agreement for Its DPA Countermeasures to Beijing Tongfang Microelectronics Co., Ltd.
- Rambus Signs License Agreement with Gemalto to Protect Against Side-Channel Attacks
- Rambus Signs License Agreement with Western Digital
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |