Ricoh Cuts Parasitic Extraction Design Closure Time in Half Using Cadence Quantus QRC Extraction Solution
Ricoh Adopts Cadence Extraction Solution for All Complex Digital and Mixed Signal Designs
SAN JOSE, Calif., 15 Jul 2014 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Ricoh Corporation, Ltd. implemented Cadence® Quantus™ QRC Extraction Solution after a rigorous competitive evaluation. By using Cadence’s next-generation parasitic extraction solution for all large-scale, complex digital designs and mixed signal power management ICs for their mobile products, Ricoh has cut its design flow parasitic extraction time in half for system-on-chip (SoC) designs.
“As a key contributor in realizing a smart-energy society by providing analog semiconductors led by high value-add power management IC products, the Electronic Devices Division of Ricoh is very keen on improving quality and performance. Through our evaluation, we found the Quantus QRC Extraction Solution delivered tighter accuracy, better capacity handling, performance, and signoff flow turnaround time,” said Keiichi Yoshioka, general manager, First Development Department Electronic Devices Division at Ricoh Corporation. “Furthermore, because Quantus QRC Extraction Solution seamlessly integrates with our installed Cadence Encounter® Design Implementation System, we get closer correlation between implementation and signoff, a reduction in unnecessary design cycles and ensured on-time tapeout.”
Quantus QRC Extraction Solution is targeted for digital and custom analog flows. The tool features a massively parallel architecture for top performance and scalability across hundreds of CPUs. Its high-accuracy modeling engine has been significantly enhanced to support FinFET designs and uses the same foundry-qualified “qrctechfiles” for digital and transistor extraction. Its incremental extraction functionality reduces design closure time by performing extraction solely on changed nets rather than requiring a re-extraction of the entire design. The solution, employing a robust 3D modeling framework, is fully certified down to 16nm FinFET processes.
For more information on Quantus QRC Extraction Solution, please visit the product landing page at www.cadence.com/news/quantusqrc.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
|
Cadence Hot IP
Related News
- Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution
- Cadence Announces Next-Generation Quantus QRC Extraction Solution, Delivering Best-in-Class Performance and Accuracy
- Cadence Quantus QRC Extraction Solution Certified for TSMC 16nm FinFET
- Cadence Digital Implementation and Parasitic Extraction Tools Enabled for Samsung Foundry Gate-All-Around Technology
- MegaChips Adopts Cadence RTL-to-Signoff Solution, Cuts Tapeout Schedule in Half
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |