Has Intel's Technological Lead Exhausted?
Piyush Arora, The Motley Fool
July 21, 2014
Historically, Intel's (NASDAQ: INTC ) chip fabrication process has been more advanced than its peers'. The chipmaker, for instance, is the first to mass-manufacture computing chips based on a 22nm and 14nm FinFET lithography. This technological lead, in turn, has allowed Intel to repeatedly deliver impressive performance gains under a comparable power draw, before its peers.
Heading further into 2014, however, Intel's hegemony may be challenged. GlobalFoundries and Taiwan Semiconductor (NYSE: TSM ) -- leading pure-play chip manufacturers -- are catching up fast. More to the point, their shift to 14nm and 16nm FinFET fabrication process, respectively, may be detrimental to Intel's growth going forward.
E-mail This Article | Printer-Friendly Page |
Related News
Breaking News
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Controversial former Arm China CEO founds RISC-V chip startup
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- Numem at the Design & Reuse IP SoC Silicon Valley 2024
Most Popular
- GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
- Qualitas Semiconductor Appoints HSRP as its Distributor for the China Markets
- Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
- Credo at TSMC 2024 North America Technology Symposium
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process