Multi-Video-Source Multiplexing Serial Video Transmitter for MIPI CSI2
North American Semiconductor Equipment Industry Posts June 2014 Book-to-Bill Ratio of 1.09
SAN JOSE, Calif. — July 21, 2014 — North America-based manufacturers of semiconductor equipment posted $1.47 billion in orders worldwide in June 2014 (three-month average basis) and a book-to-bill ratio of 1.09, according to the June EMDS Book-to-Bill Report published today by SEMI. A book-to-bill of 1.09 means that $109 worth of orders were received for every $100 of product billed for the month.
The three-month average of worldwide bookings in June 2014 was $1.47 billion. The bookings figure is 4.3 percent higher than the final May 2014 level of $1.41 billion, and is 10.0 percent higher than the June 2013 order level of $1.33 billion.
The three-month average of worldwide billings in June 2014 was $1.34 billion. The billings figure is 4.8 percent lower than the final May 2014 level of $1.41 billion, and is 10.4 percent higher than the June 2013 billings level of $1.21 billion.
“Semiconductor equipment bookings are at the highest level since May 2012,” said Denny McGuirk, president and CEO of SEMI. “The strength of the June bookings (three-month average) substantiate the outlook for strong double-digit sales growth this year.”
The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.
| Billings | Bookings | Book-to-Bill |
January 2014 | 1,233.2 | 1,280.3 | 1.04 |
February 2014 | 1,288.3 | 1,295.4 | 1.01 |
March 2014 | 1,225.5 | 1,297.7 | 1.06 |
April 2014 | 1,403.2 | 1,443.0 | 1.03 |
May 2014 (final) | 1,407.8 | 1,407.0 | 1.00 |
June 2014 (prelim) | 1,340.4 | 1,467.1 | 1.09 |
Source: SEMI, July 2014
The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.
The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves. The Book-to-Bill report is one of three reports included with the SEMI Equipment Market Data Subscription (EMDS).
SEMI is the global industry association serving the nano- and micro-electronic manufacturing supply chains. Our 1,900 member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Bangalore, Beijing, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.
|
Related News
- North American Semiconductor Equipment Industry Posts May 2016 Book-to-Bill Ratio of 1.09
- North American Semiconductor Equipment Industry Posts June 2015 Book-to-Bill Ratio of 0.98
- North American Semiconductor Equipment Industry Posts November 2014 Book-to-Bill Ratio of 1.02
- North American Semiconductor Equipment Industry Posts October 2014 Book-to-Bill Ratio of 0.93
- North American Semiconductor Equipment Industry Posts September 2014 Book-to-Bill Ratio of 0.94
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |