Mobile Uptick Ahead, Says ARM
Rebound expected after royalties slump
Rick Merritt, EETimes
July 22, 2014
SAN JOSE, Calif. — Growth in mobile device shipments should come out of a slump in the second half of the year and generally stay in low double digits through 2018, according to ARM's chief executive, reporting on the company's latest quarterly results. He also commented on challenges ahead with Moore's Law and fragmentation in the Internet of Things.
ARM's royalties, heavily impacted by smartphone shipments, grew just 2% in its latest quarter. Chief Executive Simon Segars said the slump was cyclical, due in part to a buildup of inventory that will dissipate in the next two quarters.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- ARM signs Meta as first chip product customer, says report
- Qualcomm says Arm has withdrawn license breach notice
- Redefining Mobile Experiences with AI-Optimized Arm CSS for Client and New Arm Kleidi Software
- Cadence Collaborates with Arm to Accelerate Mobile Device Silicon Success with New Arm Total Compute Solutions
- New Arm Total Compute Solutions enable a mobile future built on Arm
Breaking News
- Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
- SkyeChip Joins Intel Foundry Accelerator IP Alliance
- Siemens and Intel Foundry advance their collaboration to enable cutting-edge integrated circuits and advanced packaging solutions for 2D and 3D IC
- Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
- Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
Most Popular
- QuickLogic Delivers eFPGA Hard IP for Intel 18A Based Test Chip
- Siemens collaborates with TSMC to drive further innovation in semiconductor design and integration
- Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance to Deliver Next-Generation Custom SoCs at Scale
- TSMC Unveils Next-Generation A14 Process at North America Technology Symposium
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation